|
The TSMC 2023 North America Technology Symposium happened today so I wanted to start writing about it as there is a lot to cover. I will do summaries and other bloggers will do more in-depth coverage on the technology side in the coming weeks. Having worked in the fabless semiconductor ecosystem the majority of my […]
|
In this episode, recorded at IMAPS DPC 2023, Françoise von Trapp talks with Indium’s Andy Mackie, about his latest mission to address the confusing and complex lexicon of Advanced Packaging technology. He shares the backstory on the idea, he has come up with to change the way we talk about semiconductor device packaging, that will […]
|
Stacking logic requires solving some hidden issues; concerns about thermal dissipation may be the least of them. The post True 3D-IC Problems appeared first on Semiconductor Engineering.
|
Leaders from industry, government and academia convened at a summit Tuesday (April 18) in Washington, D.C. to forge national solutions at scale to address the future of U.S. innovation in microelectronics and the semiconductor workforce. Purdue Convenes CHIPS Summit in D.C. With Sec. Raimondo and Sen. Young was posted by Shannon Davis on Semiconductor Digest.
|
Checks, balances, and unknowns for AI/ML in semiconductor design. The post How Chip Engineers Plan To Use AI appeared first on Semiconductor Engineering.
|
At IMAPS DPC, Françoise von Trapp moderated a town hall discussion, DEI: It Takes a Village. The target audience was not HR or hiring managers, but the regular attendees who may be wondering what they can do to help create an atmosphere of equity and inclusion at their workplace. We asked the hard questions that […]
|
Work is underway to map heat flows in interposer-based designs, but there’s much more to be done. The post Thermal Integrity Challenges Grow In 2.5D appeared first on Semiconductor Engineering.
|
In this episode, Françoise von Trapp holds impromptu interviews with 3D InCites members who attended, exhibited, and/or presented at the 2023 IMAPS DPC in March. Topics of discussion include: Using AI in microelectronics manufacturing, how front-end processes are finding their way into the back-end, updates on glass substrates, capillary underfill advancements, dealing with wafer warpage, […]
|
Current chiplet interface standardization efforts fall short when it comes to handling analog signals and power. The post Chiplets: More Standards Needed appeared first on Semiconductor Engineering.
|
The test chips taped out at the TSMC 3nm process and adopts the TSMC CoWoS® advanced packaging technology. The post GUC Taped Out 3nm 8.6Gbps HBM3 and 5Tbps/mm GLink-2.5D IP Using TSMC Advanced Packaging Technology appeared first on EE Times.
|
The magnitude of the security challenges for commercial chiplets is daunting. The post Chiplet Security Risks Underestimated appeared first on Semiconductor Engineering.
|
This episode features interviews that were recorded live at IMAPS DPC 2023. First is an interview with CEA Leti’s Silvie Joly, who gave an industry coalition talk during the Global Business Council session, New Momentum in Semiconductors: Impact of Ecosystems, a European Case Study. Joly is the partnerships manager for 3D integration and packaging at […]
|
At the 2023 IMAPS Device Packaging Conference, there were a lot of discussions about Chiplet Technology, both in panel discussions and in general conversations. In this episode, we pulled together several interviews in an attempt to demystify and define chiplets, how they are produced and interconnected, what challenges the industry faces, and what we need […]
|
The emergence of chiplets as a technology is an inflection point in the semiconductor industry. The potential benefits of adopting a chiplets-based approach to implementing electronic systems are not a debate. Chiplets, which are smaller, pre-manufactured components can be combined to create larger systems, offering benefits… Read More The post The Rise of the Chiplet […]
|
TECHCET and TechSearch International, Inc. recently announced that the market for Semiconductor Packaging Materials totaled US$26.1 billion in revenues for 2022, and is forecasted to approach US$30 billion in 2027. New Global Semiconductor Packaging Materials Outlook – US$26B Market to Approach US$30B by 2027 was posted by Shannon Davis on Semiconductor Digest.
|
While terms often are used interchangeably, they are very different technologies with different challenges. The post True 3D Is Much Tougher Than 2.5D appeared first on Semiconductor Engineering.
|
In This episode, Françoise von Trapp interviews some of the 2023 3D InCites Award Winners, to learn about the significant accomplishments they are being recognized for. First is James Bear, TEL, who describes some of the company’s best practices that helped them secure the 2023 3D InCites Sustainability Award. Engineer of the Year, Markus Leitgeb, […]
|
Commercial chiplet marketplaces are still on the distant horizon, but companies are getting an early start with more limited partnerships. The post Mini-Consortia Forming Around Chiplets appeared first on Semiconductor Engineering.
|
Key pivot and innovation points in semiconductor manufacturing. The post Tech Forecast: Fab Processes To Watch Through 2040 appeared first on Semiconductor Engineering.
|
The AAA (U.S. auto club) must have AGHD (attention-getting deficit disorder). The headline from the organization’s latest research is: “Fear of Self-Driving Cars is on the Rise.” That should straighten things out, right? The survey was conducted across a representative sample of U.S. households, according to the reported… Read More The post AAA Hypes Self-Driving Car Fears […]
