Confusion Grows Over Packaging And Scaling – SemiEngineering
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The number of options is increasing, but tooling and methodologies haven’t caught up. The post Confusion Grows Over Packaging And Scaling appeared first on Semiconductor Engineering.
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The number of options is increasing, but tooling and methodologies haven’t caught up. The post Confusion Grows Over Packaging And Scaling appeared first on Semiconductor Engineering.
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Chip disaggregation means a larger attack surface, increasing the chances of a successful trojan or man-in-the-middle attack. The post Protecting Chiplet Architectures With Hardware Security appeared first on Semiconductor Engineering.
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Nvidia-Arm deal ‘will be good for customers,’ while Arm GPU and NPU development will continue The post Huang ‘Confident’ Nvidia-Arm Deal Will Get Past Regulators appeared first on EETimes.
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The U.S. Department of Defense has awarded Intel Federal LLC the second phase of its State-of-the-Art Heterogeneous Integration Prototype (SHIP) program. The post Intel Wins US Government Advanced Packaging Project appeared first on Semiconductor Digest.
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Growing complexity is creating an array of confusing options. The post System-Level Packaging Tradeoffs appeared first on Semiconductor Engineering.
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Somewhat limited improvements of client and server CPUs coupled with delays of new process technologies made Intel look pale. But being a large company has its perks and Intel’s roadmap reveals a path to regaining market share and mind share. The post Intel’s Roadmap: A Closer Look at Process Technologies and Production Plans appeared first […]
This week’s show covers device launches from Amazon last week and Google this week. We also talk about connected coffee machines getting hacked, Amazon letting people pay with their palm, and Apple’s smart home patents. After that, we switch to developer news with Twilio’s new IoT platform and ARM’s chip designs for autonomous robots and […]
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“Consumer appetite for data has not been reduced by the COVID-19 pandemic” asserts Cédric Malaquin, Technology & Market Analyst, specialized in RF devices & technologies within the Power & Wireless division at Yole Développement (Yole). “In fact, it’s the opposite. People realized the importance of being connected during lockdown. Most of the data traffic increase […]
This week’s podcast covers our thinking on Amazon’s new Sidewalk network, but not the devices the retailer launched on Thursday. As part of the network conversation, we also discussed LoRaWAN network operator Senet’s new $16 million in funding before detailing three upcoming products from Wyze. We then talked about sharing Alexa routines, Google’s new mystery […]
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GLOBALFOUNDRIES announced at its annual Global Technology Conference (GTC) a significantly enhanced design for manufacturability (DFM) kit embedded with advanced machine learning (ML) capabilities. The post GLOBALFOUNDRIES and Mentor Collaborate to Launch New Semiconductor Verification Solution Embedded with Advanced Machine Learning Capabilities appeared first on Semiconductor Digest.
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The Semiconductor Industry Association (SIA), in partnership with the Boston Consulting Group (BCG), today released a study analyzing the impact of proposed federal incentives for domestic semiconductor manufacturing. The post Study Finds Federal Incentives for Domestic Semiconductor Manufacturing Would Strengthen America’s Chip Production, Economy, National Security, Supply Chains appeared first on Semiconductor Digest.
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Making all the components work properly is only the beginning. The post How Secure Is The Package? appeared first on Semiconductor Engineering.
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Factors driving the development of edge computing and the benefits it could provide to a network. The post Artificial Intelligence & IP In Edge Computing For Faster 5G And The IoT appeared first on Semiconductor Engineering.
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An article written by Pradeep Chakraborty for Pradeep’s TechPoint – Yole Developpement, France, organized a session on the NAND landscape. It also looked at how Kioxia, and the other leading memory players are doing. Overview Walt Coon, VP, NAND and Memory Research, Yole Developpement, provided the NAND market overview. The market is dominated by six […]
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The unexpected consequences of the pandemic are showing up in forecasts for production equipment and microprocessors The post Forecasts: ICs, Fabs, Help Maintain Our Virtual Presence appeared first on EETimes.
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Designing with ICs created specifically for automotive applications mitigates the need to make the performance tradeoffs that chips repurposed from other uses require. The post Why Designing ICs From The Ground Up For Automotive Applications Matters appeared first on Semiconductor Engineering.
This week’s show starts off with the FBI’s concerns about the Ring doorbell, then news about Apple and Google making their COVID-19 exposure notification framework easier for states to use. We discuss consolidation in the smart apartment market, vulnerabilities in Microsoft’s Azure Sphere and then dive into a heap of newly launched devices. First up […]
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Onto Innovation (ONTO), which was created last year by a merger of Rudolph and Nanometrics – two equally-sized process control and software powerhouses — is primarily focused on optical metrology, macro defect inspection and process control software. The post Onto Innovation Focused on Process Control appeared first on Semiconductor Digest.
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Marvell is filling the void where HiSilicon used to be, both in the market and at TSMC. The post Marvell Joins TSMC’s Big League Customers with 5G ICs appeared first on EETimes.
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Building out its previous commitment, the White House is announcing a $1 billion investment into two of tech’s most promising frontiers, AI and quantum computing. Last year, the Trump administration rolled out an executive order on AI declaring its intention to bolster U.S. dominance in the field, but the order didn’t address much in the […]