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In light of Apple’s M1 processor announcement this week, let me ponder why Apple passed on the chiplets, and where chiplets make sense. The post Apple M1 Processor, Passing on the Chiplets appeared first on EETimes.
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Well, it’s official, the TSMC Board of Directors approved an investment to establish a wholly-owned subsidiary in Arizona with a paid-in capital of $3.5 billion. As history shows the investment may be more than that but $3.5B is a great starting point. This is being discussed in the SemiWiki Forum and I have been gathering […]
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Qualcomm received a license from the U.S. government to sell 4G mobile phone chips to China’s Huawei Technologies, an exemption to U.S. trade restrictions imposed amid rising tensions with China. “We received a license for a number of products, which includes some 4G products,” a Qualcomm spokeswoman told Reuters. Qualcomm and all other American semiconductor […]
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By Karen Field for Fierce Electronics – When it comes to sensor technologies for sound and voice control, innovation is happening on all fronts—from the audio device itself to the software and algorithms and big improvements in MEMS microphones themselves. AI-driven data analysis FierceElectronics recently spoke with Dimitrios Damianos, Technology & Market Analyst and Custom […]
This week’s show starts off with a conversation about Thread because it’s clear that it’s going to become an important radio for the future of the smart home. We explain why before discussing an update to LoRaWAN and an alternative to the big voice-controlled smart speakers from Josh.ai. After that, we express frustration with exploding […]
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Experts at the Table: One side is well-behaved and predictable, the other is not. How to ensure reliability across both is a looming challenge. The post Dealing With Two Very Different Sides Of 5G appeared first on Semiconductor Engineering.
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SK hynix and Intel will endeavor to obtain required governmental approvals, expected in late 2021. The post SK hynix to Acquire Intel NAND Memory Business appeared first on Semiconductor Digest.
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Consolidation and speed-to-market success in foundries have enabled leading semiconductor companies to compete successfully without their own manufacturing fabs. The post The Future of Semiconductor Manufacturing appeared first on EETimes.
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Building together a verification approach for safety and security in automotive chips is complex, multi-faceted, and extremely difficult. The post Growing Complexity Adds To Auto IC Safety Challenges appeared first on Semiconductor Engineering.
We kicked off the post-Election Day show with an update on ballot initiatives in Massachusetts, Maine, and California that have an impact on the internet of things. After that, we discussed Google’s ability to predict HVAC problems and the promise of smart thermostats. Then we focused on two devices worth covering, a smart lamp from […]
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Qorvo Inc of Greensboro, NC, USA (which provides core technologies and RF solutions for mobile, infrastructure and defense applications) has been selected by the US government to create a State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) RF production and prototyping center. The SHIP program aims to ensure that microelectronics packaging expertise and leadership is available for […]
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An iPhone teardown: There is no better entertainment than speculating about Apple’s next step in its silicon development in order differentiate its iPhones from others. The post 5G iPhone: What’s Apple’s Next Step in RF, Antenna? appeared first on EETimes.
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Intelligence at the edge is a hot topic these days. Not having to go all the way to the cloud to recognize objects, faces, speech and so on. But I find promoters can be rather fuzzy about what they mean by “the edge”. For many, intelligence at the edge means intelligence closer to the edge […]
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New equipment will help, but it’s expensive and requires more steps. The post Defect Challenges Grow For IC Packaging appeared first on Semiconductor Engineering.
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“The era of wearables is definitely here and confirmed by large consumer adoption.” asserts Jérôme Mouly, Senior Technology & Market Analyst and Business Developer at Yole Développement (Yole). “Whether wrist-worn, head-worn and hearable, body-worn, or smart clothing, we estimate the market to reach US$97.9 billion by 2025, with a 11.2% CAGR from 2019 to 2025”. […]
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Taiwan Semiconductor Manufacturing Co. expects the main driver of its growth in the next several years to be HPC, overtaking its current smartphone business The post TSMC Sees HPC As Next Inflection Point appeared first on EETimes.
In this SWE Diverse episode, Heather Doty, SWE FY21 President, speaks with one of our WE20 Keynote speakers and recipient of the Suzanne Jenniches Upward Mobility Award, Jennifer Rumsey, president of the Components Segment for Cummins Inc. Together they discuss Laura’s goals as President of Components at Cummins and a sneak peek at Jennifer’s WE20 […]
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For AMD to acquire a company as large as Xilinx comes as a shock to many. Reportedly, the deal would cost AMD $30 billion, which is almost a third of its market capitalization. The post AMD and Xilinx: A Match Made in Silicon Valley? appeared first on EETimes.
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Apple enters the 5G era with its new iPhone 12 series of smartphones. The company also introduced the HomePod smart speaker. The post Apple Finally Joins The 5G Party appeared first on EETimes.
This week’s IoT podcast kicks off with a focus on Apple’s new HomePod mini and the inclusion of the Thread protocol on the device. We then discuss how it fits into the world of smart speakers and my own recent purchases, such as my feelings about the Echo Studio and the Nest Audio. We then […]
