Recommended Reads

3D-printed Micro-scaffold Cochlear Implant May Reduce Residual Hearing Damage

Jan 22, 2020 | I-Micronews

Based on Nanoscribe’s 3D Microfabrication technology, scientists developed a 3D-microscaffold cochlear implant for steroid elution. For the first time, scientists combined a highly precise, porous 3D printed steroid reservoir with a 2D MEMS-based electrode array to fabricate a novel cochlear implant. This implant is designed to reduce the damage of residual hearing against electrode insertion […]

Dealing With ECOs In Complex Designs

Jan 22, 2020 | SemiEngineering

How corners and multiple changes to designs can slow time to market. The post Dealing With ECOs In Complex Designs appeared first on Semiconductor Engineering.

Episode 251: Here’s what people at CES said about CHIP

Jan 17, 2020

This week’s show was dedicated to a wrap up of CES 2020. Kevin and I shared how the show has changed in the last 15 years, talked about technology for Boomers, the Withings ScanWatch and ran through several new maker boards. We covered the $2 Wemos W600-PICO board, a new Arduino board for industrial use […]

Electrification & Autonomy: Another (R)evolution for the Automotive Sector? – iMicronews

Jan 17, 2020 | I-Micronews

The automotive industry is facing a downturn in car sales – this is accepted reality. The industry’s difficulties are partly linked to the political tension between China & USA, Brexit and the severe ecological regulations in Europe. These occurrences are global drivers that the automotive industry cannot predict or control but must live through. The […]

SEMI 3D & Systems Summit Keynotes Spotlight 5G, HPC and System-in-Package Innovations – Semiconductor Digest

Jan 17, 2020 | Semiconductor Digest

Top experts in 3D integration and systems for semiconductor manufacturing applications will gather at the SEMI 3D & Systems Summit, 27-29 January, 2020, in Dresden, Germany, for the latest developments and insights in 5G, High-Performance Computing (HPC), Heterogeneous Integration, 3D Roadmap and System-In-Package technologies. Global thought leaders from ASE Group, Huawei Technologies, TSMC and TechSearch […]

Uses And Limitations Of AI In Chip Design

Jan 15, 2020 | SemiEngineering

OneSpin’s CEO explains what’s changing in AI, where it’s being used, and what still has to be fixed. The post Uses And Limitations Of AI In Chip Design appeared first on Semiconductor Engineering.

Semiconductor Materials Growing to Nearly $50B Market in 2020 After Downturn

Jan 15, 2020 | Semiconductor Digest

TECHCET—the electronic materials advisory services firm providing business and technology information— announced that global revenues for semiconductor manufacturing and packaging materials are expected to grow 5.7% year-over-year (YoY) in 2020 to US$49.5B, of which 65% represents semiconductor fab materials. The post Semiconductor Materials Growing to Nearly $50B Market in 2020 After Downturn appeared first on […]

China in 2020: Navigating the new policy landscape

Jan 13, 2020 | SemiWiki.com

Image Removed This is the fourth of a four part series Many companies saw 2019 as a year when more and more regulations piled on to them. CEOs who were the legal representative for their company in China got increasingly nervous as legal teams updated them on their personal responsibility under new regulations. Unfortunately for… […]

2020 The Year of Live In-Car Remote Assistance

Jan 13, 2020 | SemiWiki.com

Image Removed After years of travel and computing remotely while on the road I have found that there are two magical experiences for the business traveler. One of those experiences is the hotline support I get from my preferred airline – United. The other is the live remote assistance I periodically receive from my company’s in-house… Read […]

CES Image Gallery: It’s a Wrap

Jan 13, 2020 | EE Times

We present visual wonders of CES 2020, including a quantum computer, an enormous flying taxi, gorgeous displays ranging from the small and flexible to the gigantic and brilliant, virtual people and real crowds. The post CES Image Gallery: It’s a Wrap appeared first on EETimes.

The Evolution Of Pervasive Computing

Jan 10, 2020 | SemiEngineering

IoT, edge and cloud are becoming demarcations for where to process data. The post The Evolution Of Pervasive Computing appeared first on Semiconductor Engineering.

VR & Loathing in Las Vegas

Jan 10, 2020 | EE Times

Using such sophisticated AR/VR techniques to manipulate children to buy products is questionable. Being gleeful about it is unseemly. The post VR & Loathing in Las Vegas appeared first on EETimes.

Episode 250: Everything that mattered at CES

Jan 09, 2020

This week Kevin and I went to Las Vegas for the annual CES event showcasing thousands of technology products under dozens of roofs. We recorded the show before we had the chance to see everything, but we did pull together this show with some of the big themes we saw developing and the news that […]

China in 2020: Electric vehicles rebound, the rise of the Greater Bay Area

Jan 08, 2020 | SemiWiki.com

Vehicle manufacturers in China had a tough 2018 and 2019. The overall market fell 8 percent by volume in 2018 and another 3 percent in the year to October 2019. Looking forward, demand faces several headwinds. Anyone spending time in a major city realizes just how unpleasant the … Read More

2020 Calendar — Engineers’ Desktops

Jan 08, 2020 | Max’s Cool Beans

The few whose desktop photos are selected will be the envy of all their engineer friends. https://www.clivemaxfield.com/2020-calendar-engineers-desktops/

Toyota’s “Woven City” Models Society Driven By AI

Jan 08, 2020 | EE Times

Toyota chairman Akio Toyoda announced Tuesday at the Consumer Electronics Show (CES) plans to build a new city in Japan. The post Toyota’s “Woven City” Models Society Driven By AI appeared first on EETimes.

New OmniVision 48MP image sensor provides unparalleled high dynamic range and 4K video performance for flagship mobile phones

Jan 07, 2020 | I-Micronews

Industry’s first sensor for flagship smartphones with dual conversion gain HDR and large 1.2 micron pixel, providing best low light performance, and Optimized Output for 4K2K Video and High Resolution Still Captures OmniVision Technologies, a developer of advanced digital imaging solutions, announced at CES the OV48C, a 48 megapixel (MP) image sensor with a large […]

What Engineers Are Reading And Watching

Jan 01, 2020 | SemiEngineering

Some new areas are emerging, while other tried and trusted topics continue to lead. The post What Engineers Are Reading And Watching appeared first on Semiconductor Engineering.

5 Defining Moments and Trends in Sensors in 2019

Jan 01, 2020 | EE Times

These events reshaped the MEMS and sensors industry in 2019 and serve as guideposts for 2020. The post 5 Defining Moments and Trends in Sensors in 2019 appeared first on EETimes.