|
IBM announced a breakthrough in semiconductor design and process with the development of the world’s first chip announced with 2 nm nanosheet technology. The new design is projected to achieve 45 percent higher performance and 75 percent lower energy use than today’s 7 nm chips. It will likely not be in production until 2024. The […]
|
Awareness grows, but so does the complexity of systems and the potential attack surface. The post IC Security Threat Grows As More Devices Are Connected appeared first on Semiconductor Engineering.
|
Mobility app developer Lyft has signed an agreement with Woven Planet Holdings, a subsidiary of Toyota Motor Corporation, for the acquisition of Lyft’s self-driving vehicle division, Level 5. The transaction also includes multi-year non-exclusive commercial agreements between Lyft and Woven Planet to accelerate the development and enhance the safety of automated driving technology. “Announcement launches […]
|
– Business is about as good as it gets- $75B WFE in 2021? – China remains strong at 32% despite SMIC lack of license – NAND remains 48% of revs versus 31% foundry – DRAM steady @ 14% – Service was record $1.3B Strong results in a strong market Lam reported revenues of $3.85B and […]
|
5G may have just arrived, but there’s lots of room to grow. The post Hyperconnectivity And The Path To 6G appeared first on Semiconductor Engineering.
|
The chip shortage is now mainstream news and something people on the street have actually heard of. The post The Chip Shortage: Moore Than Potatoes appeared first on EETimes.
|
Chiplets with multiple smaller dies integrated in a single package is a key to moving data faster. The post Advanced Packaging For Improved Network Communications appeared first on Semiconductor Engineering.
|
In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More The post Enabling Next Generation Silicon In […]
|
Challenges rise for both advanced packages and for new innovations in older technologies. The post Making Chip Packaging More Reliable appeared first on Semiconductor Engineering.
|
Recently, there have been a number of articles with titles such as “Study shows residential electronic scrap generation is declining” or “E-scrap generation on the decline, study finds.” or “E-Waste Is Declining, Government Needs To Change Laws To Keep Up – And Get Out Of The Recycling Business.” As a veteran of … Read More […]
|
When I started in EDA the big three were Daisy, Mentor and Valid (DMV as we called them). Then came Synopsys in 1986 followed by Cadence, which was a clever merger between ECAD (Dracula DRC) and Solomon Design. Daisey and Valid were pushed aside and then there were, “Three dogs hovering over one bowl of […]
|
The business agility invoked by Intel’s new CEO, including the creation of ISF, is new and based on sound reasoning. The post Intel 2.0 appeared first on EETimes.
|
Increasingly complex systems are creating much different relationships between engineering specialities. The post How Heterogeneous ICs Are Reshaping Design Teams appeared first on Semiconductor Engineering.
Get a sneak peak into SWE Magazine’s State of Women in Engineering issue in this SWE Diverse episode with Roberta Rincon, SWE’s associate director of research, and Anne Perusek, SWE’s director of editorial and publications. Listen along as Roberta and Anne discuss SWE’s upcoming research issue (to be published in April 2021), with a large […]
|
Has EDA failed to innovate, or has the semiconductor industry shown an unwillingness to adopt new tools and methodologies? As always, the answer is somewhere in between. The post Stuck In A Rut appeared first on Semiconductor Engineering.
|
More woes for the global automotive manufacturing industry. A serious fire at Renesas’ chip making plant in Ibaraki Prefecture will, according to the company, have “a very large impact” on its ability to supply devices to the sector, as well as some other sectors. The fire destroyed a significant portion of the huge facility, including […]
|
No single screening method will show all the possible defects that create opens. The post Hunting For Open Defects In Advanced Packages appeared first on Semiconductor Engineering.
|
Combined, the two companies are forecast to represent 43% of global semiconductor industry capital spending this year. The post Samsung and TSMC Seeking to Spend Their Way to Worldwide Domination of Advanced IC Technology appeared first on Semiconductor Digest.
|
In a sudden but perhaps not too surprising announcement, Micron has stated that they are ceasing all R&D of 3D XPoint memory technology. Intel and Micron co-developed 3D XPoint memory, revealed in 2015 as a non-volatile memory technology with higher performance and endurance than NAND flash memory. Intel has been responsible for almost all of the commercial […]
|
“Today, the scope for applications using glass substrates in the semiconductor field is broad and highly diversified.” asserts Amandine Pizzagalli, formerly Technology & Market Analyst, Semiconductor Manufacturing at Yole Développement (Yole) and today Finance Project Manager at Yole Finance, part of Yole. She adds:“Nowadays, the number of glass vendors able to deliver wafers and panels […]
