Samsung Considering 3 U.S. Fab Locations – EE Times
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Arizona, New York and Texas are in the running, with U.S. tax breaks likely the deciding factor. The post Samsung Considering 3 U.S. Fab Locations appeared first on EETimes.
Recommended Reads
Current And Future Packaging Trends – SemiEngineering
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Experts at the Table: Rising costs and the physical limits of reticles is forcing more companies to examine alternatives to shrinking geometries. The post Current And Future Packaging Trends appeared first on Semiconductor Engineering.
ACM Research Enters Bevel Etch Market for 3D NAND, DRAM and Advanced Logic – i-Micronews
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Wet process offers edge etch and clean to improve wafer yield with high throughput and low chemical consumption; First tool expected to ship during third quarter of 2021 ACM Research, a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, announced the launch of its Bevel Etch product, which further expands ACM’s […]
A Conversation About Onshoring Advanced Packaging in the U.S.
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The acronyms involving funding for semiconductor manufacturing are flying around Washington. There is the Chips for America Act, focused on re-shoring, The Facilitating American-Built Semiconductors (FABS) Act that promises tax credits for investments in, either equipment or fabs. and then there’s the $250 billion US Innovation and Competition Act, which earmarks $52bn for new chip […]
Amkor Empowers RF Front-end Cellular Innovations with Advanced SiP – iMicronews
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Highlights • Amkor is advancing the evolution of 5G RF module design • Amkor DSMBGA enables integration of more components • The advanced packaging market for 5G RF Front End Module (FEM) projected to reach US $2.3B by 2026 • Amkor continues to innovate in advanced SiP technologies Amkor Technology, Inc. (Nasdaq: AMKR), a leading […]
Global Semiconductor Sales Increase 29.2% Year-to-Year in June; Q2 Sales Up 8.3% Over Q1 – Semiconductor Digest
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Sales in June were 2.1% more than the May 2021 total of $43.6 billion. Global Semiconductor Sales Increase 29.2% Year-to-Year in June; Q2 Sales Up 8.3% Over Q1 was posted by Shannon Davis on Semiconductor Digest.
Member Spotlight: A Conversation About Working on the Mars Rover Perseverance
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Earlier this year, on February 18, 2021, the next-generation Mars Rover, Perseverance, successfully landed on Mars. According to Earth and Sky Magazine, Perseverance was the first artificial object to land on Mars since 2018, and the first Rover to land since 2012 when Curiosity touched down. Perseverance traveled 293 million miles (472 million km) – […]
MEMS: New Materials, Markets And Packaging – SemiEngineering
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Challenges and opportunities in manufacturing, testing, and deploying increasingly complex microelectromechanical systems. The post MEMS: New Materials, Markets And Packaging appeared first on Semiconductor Engineering.
While Industry Booms, China Worries Mount – Semiconductor Digest
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While China’s share of all semiconductor production has shot up, the Americas region has declined, raising alarm bells in Washington. “We see a continuation of this trend, with the Americas dropping by one more percent point next year and China building out its lead.” – SEMI senior principal analyst Christian Dieseldorff. While Industry Booms, China […]
Highlights of the 71st ECTC Conference – iMicronews
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The 71st IEEE Electronic Components and Technology Conference (ECTC) started on June 1 and remained open until July 16, 2021 due to popular demand. The conference was held virtually, and attracted 1,380 attendees from 23 countries. The 71st ECTC included 346 papers in 46 technical sessions and a record 14 special sessions and panels, delivering […]
System-in-Package industry: IDMs, OSATs, and Foundries are taking the Advantage – iMicronews
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Through enabling design and supply chain agility, SiP will reach more than $19B by 2026. “SiP has become synonymous with technologies ranging from high-end die-to-die chiplet-type advanced integration to devices found in mobile handsets with increased integration and functionality leveraging best-in-class advanced packaging processes.” asserts Vaibhav Trivedi, Senior Technology & Market analyst, Packaging, within the […]
Advanced Packaging Technologies Overcoming the Memory System Performance and Capacity Limitation – EE Times
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In the relentless pursuit to increase performance while reducing size, the semiconductor industry is exploring every avenue possible. Packaging, the process of combining different parts of a component, provides a promising area for advancements. An expert from SK hynix offers insights on how new packaging technologies, such as TSV (through-silicon via), are helping create smaller, […]
A Conversation About How to Be Better Allies to our LGBTQ+ Peers in the Semiconductor Industry and Beyond
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In the aftermath of Gay Pride Month, we bring you a very special episode of the 3D InCites Podcast. Even though it’s July, we believe it is important to be allies to the LGBTQ community all year round. While many companies showed support for the LGBTQ+ community by adapting their logos with rainbow colors and […]
CEO Outlook: Chiplets, Longer IC Lifetimes, More End Markets – SemiEngineering
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How the end of scaling and the electrification of everything are changing chip design. The post CEO Outlook: Chiplets, Longer IC Lifetimes, More End Markets appeared first on Semiconductor Engineering.
A brave new MEMS world: a $18.2B market by 2026 – iMicronews
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The MEMS market will grow due to new opportunities in audio for microphones, microspeakers and inertial MEMS, AR/VR for optical MEMS, and other emerging applications. “Last year when COVID-19 erupted, the effects on various industries were felt immediately, which in turn had an after-effect on the MEMS business. But the crisis did not impact all […]
Automotive Innovations In Semiconductors – SemiEngineering
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What’s changing in vehicles and how that will impact chip inspection, metrology, and manufacturing. The post Automotive Innovations In Semiconductors appeared first on Semiconductor Engineering.
Heatwaves, The Grid, and Your Electronics – EE Times
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When a heatwave taxes the power grid, that’s when we discovered how much energy our electronics were actually drawing. The post Heatwaves, The Grid, and Your Electronics appeared first on EETimes.
Will Electrification Mean the End of the Road for Automotive MEMS Pressure Sensors? – iMicronews
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The dominance of MEMS pressure sensors in the automotive market may be under threat as the industry moves to replace Internal Combustion Engine (ICE) vehicles with EVs. Electrification will reduce many ‘traditional’ application areas in hybrid models and eliminate them altogether in fully electric vehicles. The market research and strategy consulting company, Yole Développement (Yole) […]
Micron to Sell Lehi, Utah, Fab to Texas Instruments – Semiconductor Digest
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Micron Technology, Inc. announced today that it has entered into a definitive agreement to sell its Lehi, Utah, fab to Texas Instruments. Micron to Sell Lehi, Utah, Fab to Texas Instruments was posted by Shannon Davis on Semiconductor Digest.
Member Spotlight: A Conversation about Novel Nano-Coating Technology and Collaboration
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In this first Member Spotlight episode, we have a conversation with Zia Karim, Yield Engineering Systems, and Mie Lillethorup, RadiSurf about their collaboration to bring unique nanotech-based surface enhancement materials from the lab to the fab. What’s exciting about these materials and processes is the potential they hold for simplifying both temporary and permanent wafer […]
