Don’t Toss That Gasoline Engine Just Yet – SemiEngineering
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Even older vehicles can run on batteries, but there are limitations. The post Don’t Toss That Gasoline Engine Just Yet appeared first on Semiconductor Engineering.
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Globally, sustainability has become a much larger conversation than just taking steps to achieve zero carbon emissions. The UN has established 17 sustainable development goals that cover everything from climate change to diversity, equity, and inclusion. As the world becomes more socially conscious, it is no longer enough for a company to be profitable – […]
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Like cities, chips need to go vertical to expand. The post 3D IC: Opportunities, Challenges, And Solutions appeared first on Semiconductor Engineering.
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Chiplet integration can enable disaggregated server, heterogenous computing and domain-specific acceleration within data centers. The post Chiplet Strategy is Key to Addressing Compute Density Challenges appeared first on EETimes.
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How to determine appropriate electrostatic discharge robustness requirements. The post Can We Efficiently Automate 2.5/3D IC ESD Protection Verification? appeared first on Semiconductor Engineering.
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Advanced packaging is now of strategic importance for IDMs, foundries, and OSATs, leading to more than US$10 billion in investment. “The advanced packaging market was worth US$30 billion in 2020 and is expected to grow at a CAGR of 8% to reach US$47.5 billion in 2026 during this period”, asserts Santosh Kumar Principal Analyst & […]
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I’ve attended the DAC conference and trade show since the late 1980s, and every visit has been a continuing learning experience about the EDA, IP and semiconductor industry. I first started attended as an EDA vendor in 1987, and since 2004 as a freelance marketing professional. There’s a significant amount of preparation… Read More The […]
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Many electronic devices today are dependent on semiconductor logic circuits based on switches hard-wired to perform predefined logic functions. Physicists from the National University of Singapore (NUS), together with an international team of researchers, have developed a novel molecular memristor, or an electronic memory device, that has exceptional memory reconfigurability. NUS Researchers Develop Brain-Inspired Memory […]
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Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE
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A new report predicts that the global semiconductor packaging market will reach $60.44 billion by 2030 from $27.10 billion in 2020, growing at a CAGR of 9.10% from 2021 to 2030. Semiconductor Packaging Market to Reach $60.44B by 2030 was posted by Pete Singer on Semiconductor Digest.
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Renewable Energy, Tech Innovation Needed to Slow Climate Change – EE Times
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Wafer-Level Fan-Out For High-Performance, Low-Cost Packaging Of Monolithic RF MEMS/CMOS – SemiEngineering
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The benefits of WLFO versus flip-chip land grid array (FCLGA) packaging for a radio frequency (RF) MEMS digital tunable capacitor array. The post Wafer-Level Fan-Out For High-Performance, Low-Cost Packaging Of Monolithic RF MEMS/CMOS appeared first on Semiconductor Engineering.
