IMAPS DPC 2024 Makes Advanced Packaging Fun Again!
Mar 26, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
Latest Posts - Page 27
Ziptronix Goes Commercial
Ever since I got involved in the world of advanced packaging, and particularly 3D, I’ve had a soft spot for...IEDM 3D Panel: Is 3D Just Hype?
We’ve been hearing so much lately from the 3D integration cheering section, that it’s actually hard to believe that there...A Little Disruption can be Good for You!
Two weeks ago, wearing my Chip Scale Review Sr. technical editor hat, I attended (along with 11 other journalists) an...The Million Dollar 3D Question
With all the latest hubbub about FinFets (or as Intel calls them, TriGate transistors) , there seems to be some...Rest in Peace, Steve Adamson
Once again I find myself using this blog space to venture outside the scope of normal coverage to offer some...MEMS Executive Congress 2011 to Showcase the Coolest in MEMS Applications
Are you going to this year's MEMS Executive Congress? I was invited, but unfortunately won't be able to attend. I'm...2.5D and 3D Supply Chain Solutions – is there only one?
I had a bit of an “aha!” moment yesterday at the MEPTEC 2.5D, 3D and Beyond Conference, with regard to...Inspiring the Semi Industry’s New Frontier
Last week I attended SEMICO’s Research Summit, in Scottsdale, AZ, and was fortunate to hear some high-level industry executives discuss...Changes are Afoot at 3D InCites
I knew we were onto something when Leo Archer and I chose 3D ICs and 3D packaging as the top...Walker’s 2011 Forecast: After the 2010 Boom – Now What?
What the room heard: Get ready for a second downturn. DRAM is in the tank because PC production is down,...
