The EU’s Semiconductor Strategy: CHIPS Act 2.0, Investments, and More
Dec 03, 2025 · By Jillian McNichol · Interconnectology 101
3D In Context View all
SEMICON West Navigates Semiconductor Industry Changes
As Benjimen Franklin said, shortly after the US Constitution was written, “In this world, nothing can be said to be certain, except death and taxes.” I’ll add one comment to that: Change. Change is constant. Over the past year, there has been a significant amount of change in the semiconductor...
Advanced Packaging: A Community Coming Together
In the past 16 years, 3D InCites has watched the 3D packaging industry grow. The philosophy of 3D InCites was to create an advanced packaging community. At SEMICON West in Phoenix, the community was out in force, from ribbon-cutting ceremonies for new facilities, to new packaging equipment companies showing for...
The 3DICAMA and Other Efforts to Develop the 3D IC Ecosystem
This Fall has been a busy time for semiconductor events. Starting with SEMICON Taiwan at the start of the month, IMAPS in Late September into early October, followed closely by SEMICON West last week. Fortunately, there is a month off to catch your breath before heading to Semicon Europa. There...
Can We Make Data Centers Less Power Hungry?
When the headline reads “Power Usage in Wyoming data center could eclipse consumption if the state’s human residents by 5x, the tenant of colossal investment remains a mystery.“ It grabs your attention. The article goes on to discuss that the data center is expected to start at 1.8 gigawatts and...
Francoise in 3D View all
Passing the Torch: Reflections from SEMICON Europa 2025
While announcing my retirement after 20 years in the industry at IMAPS Symposium brought my career in advanced packaging full circle, wrapping up my 3D InCites career at SEMICON Europa brought closure. It was at SEMICON Europa 2007, held in Stuttgart, where my fascination with 3D integration and packaging first...
Francoise Unfiltered: Thoughts from IMAPS Symposium and SEMICON West
Maybe it’s my impending retirement, but I’m feeling a little salty these days. This my fifth draft about the highlights, low-lights and Aha moments of both IMAPS Symposium and SEMICON West. And I can’t get it right. All that comes up is my annoyance with carefully crafted messaging because nobody...
Changes at 3D InCites: Here’s What You Need to Know
I recently realized that IMAPS Symposium 2025 marks my 20th anniversary in the microelectronics industry. It was the first industry event I attended, as the Associate Editor of Advanced Packaging Magazine. My first SEMICON West was in 2006, and my first SEMICON Europa was in 2007. That was when I was first...
IMAPS Executive Summit: Advanced Packaging Comes to Silicon Valley
To celebrate the re-boot of Silicon Valley’s IMAPS Chapter, Chair Rozalia Beica, Rapidus, conceptualized and launched – with the help of the local committee and the IMAPS team – the first ever IMAPS Executive Summit. The theme was Advanced Packaging 2025: Market Momentum & Investment Outlook. According to Beica, what...
From Different Dimensions View all
From Reactive to Proactive: Semiconductor Shipment Visibility in 2025 and Beyond
In 2024, electronics cargo theft, including semiconductors, servers, and high-end computing equipment, surged dramatically, exposing a critical vulnerability in supply chains. ¹ This threat is not just a security issue for companies shipping semiconductors and other high-tech components; it directly impacts revenue, causes production delays, and compromises customer trust. Often,...
Jessica Yang: My Summer Internship at Saras Micro Devices
By Jessica Yang, HR Intern, Saras Micro Devices Hi, I’m Jessica Yang, a rising junior at Washington University in St. Louis, studying Organizational & Strategic Management and Sociology. With my two interests, I’ve always been passionate about the people side of business, which is why I was looking for internships...
Henrik Ng: My Summer Internship at Saras Micro Devices
My name is Henrik Ng and I am an Electrical Engineering student entering my junior year at Georgia Tech. I was eager to gain both hands-on experiences and theoretical understandings in the realms of RF engineering, as inspired by my previous research project surrounding RFID energy harvesting. At the same...
October Member News: Shaping a Smarter, More Connected Semiconductor Future
October proved to be a dynamic month across the semiconductor and advanced packaging ecosystem, marked by innovation, expansion, and global collaboration. From groundbreaking facility announcements and strategic partnerships to prestigious industry recognitions, members continued to push technological and manufacturing boundaries. The month also featured major events, where companies unveiled cutting-edge...
Interconnectology 101 View all
Co-Packaged Optics: Today’s Biggest Packaging Push
Co-packaged optics is one of the most talked about innovations in advanced packaging right now, and it’s for good reason. It promises higher bandwidth density, lower power consumption, and reduced latency over other packaging approaches – all of which are essential for enabling smarter AI solutions. To learn more about...
Will AI Ever Become Profitable?
Last year, I wrote a blog on the growth of AI, where I broke down the public hype around the technology and the barriers preventing it from scaling further. Earlier this year, Gartner projected that worldwide AI spending will reach $1.5 trillion by the end of 2025, up $490 billion...
Geopolitical Changes, Sustainability Progress, and Collaboration Efforts at SEMICON West 2025
This year’s SEMICON West was its largest exhibition in over 18 years. With a 60% boost in registrations over 2024, the size of SEMI’s first-ever Phoenix conference points to growing interest in the semiconductor industry. As you can imagine, much of this interest is driven by AI. On October 7th,...
What the U.S. Government Stake in Intel Could Mean for the Semiconductor Industry
On August 22, Intel confirmed in a press release that it agreed to give a 10% stake of its company to the United States federal government in exchange for $8.9 billion in funding. Of this amount, $5.7 billion was set to come from its CHIPS Act allocation, and $3.2 would...
Packaging IFTLE View all
IFTLE 647: Micross AIT on Track to Deliver 300mm Bumping Onshore
Continuing our look at program information deemed “OK for public release” at the recent IMAPS Onshoring conference, let’s examine what Micross had to say about progress on its Re-shore Ecosystem for Secure Heterogeneous Advanced Packaged Electronics (RESHAPE) 300mm bumping line, sponsored by DARPA’s Industrial Base Analysis and Sustainment (IBAS) program....
IFTLE 646: TSMC 3Dblox 2.0 Helps Advanced Packaging Designs
The 3Dblox Open Standard Continues to Evolve Introduced in 2022, the 3Dblox open standard has provided EDA vendors with a pathway to model the essential physical stacking and logical connectivity information for 3D IC designs in a single format. 3Dblox reportedly simplifies 3D IC design by providing a complete view...
IFTLE 645: ASE Packaging in Koahsiung; Amkor Advanced Packaging in AZ; US-SMC?
ASE to build new packaging facility in Kaohsiung Taipei Times reports that ASE, the world’s biggest chip assembly and testing service provider, said it is investing $578.6M to build a new advanced chip packaging facility in Kaohsiung to cope with fast-growing demand from artificial intelligence (AI), high-performance-computing (HPC) and automotive...
IFTLE 644: IBM’s Scott Sikorski details their Onshore Advanced Packaging for AI, HPC and Defense Applications
The recent IMAPS Onshoring workshop included Scott Sikorski, IBM Global Business Development Leader, reviewing details of their onshore advanced packaging efforts for AI, hig performance computing (HPC) and defense applications. The IMAPS “Onshoring” meeting is restricted to US citizens and thus IFTLE will not be able to review most of...
Latest Posts
Sustainability 101: Startups with Innovative Materials
Finalists for SEMI’s Startups for Sustainable Semiconductors (S3) program pitched their solutions at SEMICON West. As in previous years, most...
IFTLE 643: GlobalFoundries New York Advanced Packaging and Photonics Center
At the recent IMAPS Onshoring Workshop, Greg Kleese, Director of Aero & Defense Business Development, GlobalFoundries, made the presentation “GlobalFoundries...
IFTLE 642: TSMC Advanced Co-packaged Optics Integrated CoWoS and COUPE
At the Open Compute Project (OCP) / APAC Summit in Taiwan, S.Y Hou (Director of Advanced Packaging Integration, gave a...
How My Internship at Brewer Science Shows Me the Power of Teamwork and Innovation
By Wyatt Harris, Marketing Intern at Brewer Science This past summer, I was given the opportunity for a marketing internship...
September Member News: Innovation and Collaboration
The month of September saw continued momentum in the semiconductor industry, highlighted by exciting industry events, innovative technology launches, and...
IFTLE 641: Is the CHIPS Act Becoming the CHIPS Investment Act?
Plus: TSMC Packaging in AZ; Deca/Microchip/SST Non-volatile Memory Packaging Taiwans Minister of Economic Affairs reports that he received information about...
SEMICON West Member Preview 2025
After more than 50 years in San Francisco, SEMICON West is making its debut in Phoenix, Arizona! As Arizona transforms...
The 2025 Startups for Sustainable Semiconductors
The last time I attended a SEMICON in October was in Austin in 1999. It was one of the last...
IFTLE 640: Intel Ohio in Limbo; US Government Acquires 10% Stake in Intel
Intel Ohio is started, but when will it be finished? The Columbus Ohio Dispatch has just reported that Intel is...
Allen Mai: My Summer Internship at Saras Micro Devices
Hi, I’m Allen Mai, a senior studying Computer Science at Georgia Tech. I found Saras Micro Devices on LinkedIn and...
IMAPS Symposium Member Preview 2025
The IMAPS Symposium is just around the corner! Taking place from September 29 through October 2 at the Town &...
Risk Mitigation in Semiconductor Capital Equipment Logistics 2025
Discover the key challenges in semiconductor capital equipment logistics—and how to build a proactive, flexible, and future-ready supply chain that...
August Member News: Pivotal Shifts in Leadership, Investments and Innovation
The month of August held pivotal shifts in the semiconductor industry, marked by leadership transitions, targeted investments, and continued innovation...
IFTLE 639: Are Things Worsening for Intel? Will Samsung Add Advanced Packaging in Texas?
Intel Concerns Continue to Grow Long time readers of IFTLE know that we have been following the technical and financial...
The Unfinished Revolution for Advanced Packaging and Heterogeneous Integration
Amazing breakthroughs lie ahead. It won’t be easy — but it will be awesome. How it started I remember when...
IFTLE 638: TSMC Advanced Packaging Coming to AZ; Intel Stops Internal Glass Core Substrate Funding
TSMC Advanced Packaging in US Scheduled for 2028; Focusing on SoIC/CoPoS From Taiwan we hear that TSMC has accelerated Fab...
Reducing Greenhouse Gas Emissions Starts with Raw Materials
Everybody’s talking about reaching net-zero greenhouse gas emissions, but what does this actually entail? According to Pierre Farbos de Luzan,...
Sustainability 101: Carbon Credits – Definitions and Directions
If your company is committed to achieving net zero carbon emissions, meeting that commitment will require purchasing carbon credits. Although...
IFTLE 637: UMC Re-Enters the Advanced Chip and Advanced Packaging Markets
According to Nikkei Asia, UMC is eyeing 6nm production, with a focus on chips for Wi-Fi, RF, Bluetooth, AI accelerators,...
