Finetech

Finetech’s high‐accuracy die bonding equipment supports the most precise and complex applications in advanced packaging, die attach and micro assembly. Sub-micron placement is possible with an extensive range of bonding technologies including thermo-compression, ultrasonic, eutectic, epoxy, sintering, ACF/ACP, Indium and precision vacuum die bonding. Quality optics and highly stable machine design provide the accuracy and repeatability that today’s applications demand. Manual, motorized and automated models provide an equipment migration pathway from R&D and prototyping to production.