At Laser World of Photonics in Munich, Finetech will present the successor of its acclaimed sub-micron bonder for research and development. Technological innovations make the high-precision placement and assembly system the ideal starting point for cost-efficient and fast development of optoelectronic products.

As a manufacturer of micro assembly equipment and process technology, Finetech has been supporting start-ups as well as global technology leaders in the development of innovative semiconductor products for more than two decades. The FINEPLACER® lambda – a versatile, high-precision and compact R&D die bonding system with an unrivaled price/performance ratio – is a cornerstone in Finetech’s product line-up.

At Laser World of Photonics, the Berlin-based company presents the successor of this successful model. The FINEPLACER® lambda 2 continues the virtues of its predecessor and sets new benchmarks in optoelectronics assembly.

High-precision placement and assembly
With the FINEPLACER® lambda 2, components can be placed and bonded with an accuracy of better than 1 micrometer – ideal for the high requirements, e.g. in the development of opto-electronic products such as transceivers (TOSA/ROSA) or laser diode modules.

Thanks to the proven FINEPLACER® alignment and placement principle with only one moving axis, the system provides highest process quality, stability and accuracy. In combination with specially developed interchangeable optics with a resolution of down to 0.7 µm, it enables overlaying images of the highest optical quality. Even finest structures in sub-micrometer range can be reliably detected and aligned. For each application, the user can choose between different image field sizes to ensure optimum viewing conditions for all supported component dimensions.

Modularity for flexible use
The completely revised bonding platform is still available in manual or semi-motorized configurations and can now be equipped even more conveniently with a variety of extension modules for very different assembly and bonding technologies, including eutectic soldering, thermocompression bonding or bonding with UV-curing adhesives. This technological diversity opens up a particularly wide range of applications, which can be further extended by a large bonding force range.

Thanks to the modular system architecture, the machine always remains flexible: if, for example, applications are to be bonded with ultrasound at a later point in time, the required process module can simply be retrofitted by the user himself via plug & play.

Process development cannot be more flexible, at the same time follow-up costs are kept low and the future security of the investment is guaranteed even with changing application requirements. That makes the FINEPLACER® lambda 2 the ideal proposal for users in education, research and development who continually need to implement new and adapted technologies and processes.

Focus on the user
During the development of the FINEPLACER® lambda 2, Finetech has consistently focused on the needs of the user. Thanks to the ergonomic machine design and software-assisted user guidance, the operator always remains at the center of action.  The uniform operating concept with clearly structured process sequences also ensures a quick familiarization with the machine.

The library-based toolbox design of the newly developed IPM Command operating software simplifies the setup and modification of process sequences. Instead of predefined scripts, the user can freely create, modify and combine sequences. Due to the intelligent user guidance, user errors can be minimized.

Starting point for product development
With IPM Command, the FINEPLACER® lambda 2 also follows Finetech’s integrated software concept. Whether prototyping device or production system – all new FINEPLACER® machines are based on the same software platform. Processes created and certified during the development phase can be quickly and easily transferred to Finetech’s automated production systems. This enables a seamless transition from development to series production and a fast ramp-up of production.

With sub-micron accuracy from development to series production. The FINEPLACER® lambda 2 is the ideal starting point for successful product development in optoelectronics.

Finetech at the Laser World of Photonics in Munich
The European premiere of the new FINEPLACER® lambda 2 will take place from 24 to 27 June 2019 at the Laser World of Photonics in Munich.


Finetech’s high‐accuracy die bonding equipment supports the most precise and complex applications in advanced packaging,…

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