Bob News
A Focus on Chiplet Verification
Chiplets have become a strategic asset for designers who are implementing them in all sorts of applications. Until now, chiplet...
An Epic Chiplet Evolution
Jean-Marie Brunet, Vice President and General Manager of the Siemens Hardware-Assisted Verification business unit finds himself and his group in...
Advanced Packaging Authority John Park Discusses 3DHI and the World of Chiplets
John Park, product management group director, of Custom IC & PCB Group at Cadence, is a go-to authority on advanced...
Forging a New Future for 3D IC Design and Architecture
The semiconductor industry’s ability to coax more and more performance out of a chip has produced the most significant innovations...
SEMICON West Smart MedTech Panel: Design Verification in the Supply Chain
All electronic products begin with design be it a single chip, a collection of chips or chiplets such as 3D-IC,...
Phil Kaufman Hall of Fame Posthumously Acknowledges Distinguished Contributions
The upcoming ceremony and banquet for the 2021 Phil Kaufman Award for Distinguished Contributions to Electronic System Design on May...
ESD Alliance Webinar about Export Compliance with Insights from an Expert
In the ESD Alliance line-up of Fall 2021 events, next is a webinar on export compliance, a topic that affects...
The ESD Alliance: A Forum to Address Cross-Industry Issues
Members of the ESD Alliance are vital to the semiconductor industry, providing comprehensive solutions for the planning, design, and verification...
