According to the market research and strategy consulting company, Yole Développement (Yole), the polymeric materials market revenue will double over the next five years. Driven by movements towards further miniaturization and higher functionalities, megatrend applications like artificial intelligence (AI), 5G, and augmented/virtual reality (AR/VR) are creating huge business opportunities. Therefore, the megatrends are directly contributing to the growth of the advanced packaging industry, showing an impressive 7% compound annual growth rate (CAGR) to reach US$39 billion in 2023[2]. Today, megatrend applications are fueling the next generation of advanced packaging platforms including high-density FOWLP, 3D stacked TSV memory, WLCSP, and flip-chip.
In its new report, Polymeric Materials for Advanced Packaging at the Wafer Level, Yole presents 2017 – 2023 market figures and dynamics of the market, per packaging platforms integrating polymeric materials. It includes a comprehensive analysis of the existing polymeric materials used for each advanced packaging process step, along with their status. Also presented is the maturity level of each polymeric material, by advanced packaging function and a detailed technology roadmap.
The Semiconductor & Software team from Yole offers you today a deep analysis of the massive adoption of polymeric materials by the advanced packaging industry.
“The innovative advanced packaging platforms have reached a new level of complexity and now demand higher integration-level requirements,” asserts Amandine Pizzagalli, Technology & Market Analyst, Semiconductor Manufacturing at Yole. “These lofty standards will strongly influence the increasing demand for advanced materials with new technical specifications, in order to achieve better performance.”
With respect to materials, polymeric materials are already being applied in large-volume manufacturing in some advanced packaging process steps. Today, they have already found integration in major process steps: RDL, bump/UBM, TSV, and assembly levels, as well as at the bonding interface.
Yole identified a wide variety of polymeric materials available to packaging manufacturers: PI, PBO, BCB, epoxies, siloxanes, and acrylic, all of which are defined by their constant dielectric, cure temperature, stress, etc.
Polymeric materials present excellent electrical, chemical, and mechanical properties: they could offer better performance than any other type of materials. According to Yole’s report, materials will increasingly be implemented when adopting additional functionalities in the same field.
The polymeric materials market generated revenue in excess of US$700 million in 2018. It is expected to peak at about US$1,3 billion by 2023 with a 12% CAGR depending on the material type over this period. The market is driven by the dielectric material segment, analyzes Yole’s team in its report.
Polymeric materials growth will find support mostly from the expansion of dielectric material for more complex devices, followed by the broad introduction of polymeric temporary bonding material. The latter will be accelerated by the ramp-up of 3D stacked through silicon vias in DRAM memory applications…
A detailed description of this report is available on i-micronews.com, manufacturing reports section.
[1] Source : Status of the Advanced Packaging Industry report, Yole Développement, 2018
Source: www.yole.fr
