Archives July 2013 - 3D InCites

Multitest: Handling the Mobility Market

Multitest: Handling the Mobility Market

What better way to wrap up a busy week at SEMICON West 2013 than a site visit? After three days of interviews and PowerPoints, I was ready for some some hands-on demonstration. Barbara Loferer, marketing manager of Multitest, was concluding an open-house week at the company’s San Jose facility to promote the company’s current focus on the mobility market and subsequent product enhancements, a... »

ASML at Semicon West 2013: SRAM Scaling has Stopped!

ASML at Semicon West 2013: SRAM Scaling has Stopped!

We have a guest contribution from Zvi Or-Bach, the President and CEO of MonolithIC 3D Inc. Zvi adds information to his previous blog post: Dimension Scaling and the SRAM Bit-Cell. I just downloaded the ASML presentation from Semicon West2013 site – ASML’s NXE Platform Performance and Volume Introduction. Slide #5 – IC manufacture’s road maps – says it all. Embedded SRAM will ... »

Atoms Don’t Scale: What is Beyond 7nm (2019)?

Atoms Don’t Scale: What is Beyond 7nm (2019)?

We have a guest contribution today from Brian Cronquist, MonolithIC 3D Inc.’s VP of Technology & IP. Brian discusses about MonolithIC 3D Inc.’s participation at Semicon West 2013. Thanks to everybody who came by the Silicon Innovation Forum poster session at SEMICON West 2013. We really enjoyed talking with you about all the exciting possibilities for new products and processes th... »

Rudolph Announces New Metrology Suite for Advanced Packaging

Rudolph Announces New Metrology Suite for Advanced Packaging

New NSX Metrology Series includes application-specific configurations to address unique metrology requirements for wafer level packaging, 2.5D and 3DIC  Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, today released three new application-specific configurations ... »

FormFactor Tackles Probe Test for 3D ICs

FormFactor Tackles Probe Test for 3D ICs

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. For a long time, the jury was out on the probe-ability of micro-bumped TSV wafers. The jury was also unsure whether or not there was any point to probing to ensure known good die (KGD) or will “probably good die” suffice, given the cost of test? Probe test companies, FormFactor and Microprobe wer... »

wet etch

SSEC’s New Chemistry for TSV Reveal

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SSEC had a lot to celebrate at this year’s SEMICON West, 2013. The company launched two new equipment platforms, WaferStorm and WaferEtch, each configuring single wet wafer processes for specific applications. Two of the tools launched on these platforms apply directly to the 3D IC market, the TSV ... »

How will the 450mm Transition Affect Advanced Packaging and 3D ICs?

How will the 450mm Transition Affect Advanced Packaging and 3D ICs?

That was my kick-off question for Manish Ranjan, Vice President, Product Marketing, Advanced Packaging/Nanotechnology Segment at Ultratech, during our annual SEMICON West Thursday wrap-up discussion. It’s never been planned that way, but I always seem to interview Ranjan at the tail-end of SEMICON West, and subsequently end up bouncing a weeks accumulation of thoughts off of him. What inspired t... »

Figure 1: Electrografting provides a very strong adhesion between organics and any surface

Alchimer Streamlines Wet Approach

Streamlined and versatile: that’s the impression I came away with after talking to Nao Shoda, senior director of business development and technology, Alchimer, about recent developments to further optimize the companies’ electrografting processes for through silicon via (TSV), isolation, barrier, seed and fill steps. I wrote about them frequently in the company’s early days, and again si... »

SETNA: Atmospheric Plasma Surface Modification

SETNA: Atmospheric Plasma Surface Modification

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SET is known in the 3D IC world for its high accuracy die bonder for die-to-die and die-to-wafer stacking. The SET Representative in North America (SETNA) has also launched a companion tool, ONTOS7, for the purpose of removing surface oxidation, such as copper oxide from copper pillars. I spoke with ... »

Figure 2: Shows the photo of a 50 μm thin wafer after debond on a tape.

Dow Corning offers the Power of Silicone Technology

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. After my interview with imec’s Ludo Deferm, I met up with Andrew Ho, global industry director, advanced semiconductor materials, for Dow Corning’s Electronic Solutions, to get an update on Dow Corning’s developments in 3D IC assembly materials. I’d previously interviewed Ho’s colleague,... »

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