Archives March 2013 - 3D InCites

SUSS MicroTec Announces Follow-up Order for 300mm Bonding Tools for HVM 3D ICs

SUSS MicroTec Announces Follow-up Order for 300mm Bonding Tools for HVM 3D ICs

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets has received a follow up purchase order for the latest generation of high volume manufacturing temporary bond clusters from a world-leading IDM (Integrated Device Manufacturer). The customer, who  installed SUSS MicroTec tools in 2012, plans to enter into a pilot production wit... »

Easing the 3D IC Pain at IMAPS DPC 2013

Easing the 3D IC Pain at IMAPS DPC 2013

In his keynote address at this year’s IMAPS Device Packaging Conference (IMAPS 2013) Sitaram Arkalgud, of Invensas, touched on a number of remaining technology “choke points” that need to be addressed before high volume manufacturing of 3D ICs can take off. Obligingly, a number of presenters following his talk offered balms for easing several of them. When it comes to temporary bonding and ... »

3D Talk at IMAPS DPC 2013

3D Talk at IMAPS DPC 2013

At this year’s IMAPS International Device Packaging Conference, despite a robust line-up of speakers and presentations focused on 2.5D and 3D integration technologies, I came away feeling slightly empty handed. Concerned that this was just my own perspective after years of 3D IC total immersion, I asked around to take the pulse of the other attendees, many of whom are 3D IC ‘regulars’ like m... »

The Hills are alive – in the Hill Country – The Interposer workshop in Austin

The Hills are alive – in the Hill Country – The Interposer workshop in Austin

Did anyone miss the Sound of Music bit during the Oscars? Anyway, with the sounds of “The Hills are alive..” in my head, I drove off the next day down to the Hill Country in Austin to the invitation-only, On The Road to Fine Feature IC Package Substrates and Interposers Workshop, hosted by Jan Vardaman of TechSearch International. This is a nice, comfortable-sized venue with approximately 100 ... »

BiTS Workshop 2013

Interconnectologists and Market Analysts See Eye to Eye on The Changing IC Industry at BiTS Workshop

Every year in early March, I spend a day at the BiTS Workshop (Burn-in Test Strategies), not because it’s a hotbed of 3D technology information (although this year there were some papers addressing 3D test as solutions are now becoming available) but because I’ve been working with the General Chair, Fred Taber, for years, first during my tenure at Advanced Packaging Magazine, and then at Chip... »

Cherry Blossoms

Viewing 3D IC Blossoms at SPIE Advanced Lithography 2013

Are you familiar with the Japanese custom of cherry blossom viewing? “Hanami (花見, lit. ‘flower viewing’) is the Japanese traditional custom of enjoying the beauty of flowers, ‘flower’ in this case almost always meaning cherry blossoms (‘sakura’) or (less often) plum blossoms (‘ume’).” (Source: Wikipedia.) But what, you may ask, does cherry blossom viewing have to do with 3... »