In this article, published in the May/June 2010 issue of Chip Scale Review Magazine, Steve Lerner, CEO, Alchimer, proposes a “variation on theme” for TSV cost-of-ownership.

3D integration and More-than-Moore are popular topics in the semiconductor industry, with
high expectations for eventual wide use of 3D-IC technologies. But the pace and
scale of adoption is largely dependent on long-term cost of ownership (CoO).
This article presents an alternate perspective from those through-silicon-via (TSV)
consortia oriented around adaptation of front-end processing, examining all
aspects from design to factory-floor deployment. (full story)

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