Latest Posts
Addressing the Challenges of Surface Preparation for Advanced Wafer Level Packaging
As the semiconductor industry shifts focus from CMOS scaling to heterogeneous integration, the importance of surface preparation and wafer cleans...
Replacing NMP: Are You Ready?
NMP is an abbreviation for N-methyl-2-pyrrolidone (other synonyms are 1-Methyl-2-pyrrolidone and 1-Methyl-2-pyrrolidinone) (Figure 1). NMP has proven itself as an...
Executive Viewpoint: Update on Cleans
Last time I checked in with Kim Pollard, Technology Manager, Dynaloy, was a few years ago, when we talked about...
Akrion Systems: Vacuum Prime and Dry
Akrion Systems’ vacuum prime and drying technology enables the use of a wet immersion method to introduce liquid chemicals or...
SETNA: Atmospheric Plasma Surface Modification
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SET is known...
SET North America: ONTOS7 Surface Preparation System
Product Description The ONTOS7 Atmospheric Plasma Surface Preparation Tool removes native oxides, residual organics or other bond-inhibiting films at atmospheric...
