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SiC MOSFET Challenges, Demand and Industrialization of Test & Burn-in
The coming-of-age and breakthroughs offered by silicon carbide (SiC) MOSFETs, as well as demand that is outstripping supply are rapidly...
Increasing the Conductive Density of Power Packaging
March 3, 2021 – Wide bandgap (WBG) semiconductor technologies have created new challenges and opportunities for power packages. Developments such...
Eutectic Die Attach Optimizes High Power GaN Devices
Details how to reduce chip-to-package junction temperature to improve GaN chip efficiency and reliability StratEdge Corporation, a leader in the...
StratEdge Features its High-frequency, High-power Semiconductor Packages and Assembly Services at Three Trade Shows in March
StratEdge Corporation, a leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and...
2020 Outlook: Optimism Ahead! The Opportunities are There
I am writing this viewpoint while 2019 will close in a couple of days. If I try to summarize what...
Could ON Semiconductor be GlobalFoundries’ White Knight?
In light of recent rumors, could ON Semiconductor’s acquisition of GlobalFoundries’ East Fishkill fab save the company from being carved...
IFTLE 410: ST Microelectronics Bets on SiC; A Look at Power Device Packaging
Silicon Carbide (SiC) is a wide bandgap (WBG) material that has advantages when compared to silicon (Figure 1). For the...
