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IFTLE 644: IBM’s Scott Sikorski details their Onshore Advanced Packaging for AI, HPC and Defense Applications                                                                                       

Oct 27, 2025 · By Phil Garrou · Blogs
The recent IMAPS Onshoring workshop included Scott Sikorski, IBM Global Business Development Leader, reviewing details of their onshore advanced packaging...
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Semiconductor Packaging Materials: The Unseen Marvels of Semiconductors

Oct 02, 2024

Semiconductors are the micro-sized “brains” that power modern electronics, and...

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