IFTLE 440: Copper Pillar Bump Development for 7nm Node DevicesFeb 10, 2020 · By Phil Garrou · Blogs In the latest issue of IMAPS “Advancing Microelectronics” magazine (Nov/Dec 2019) Lei Fu and his colleagues at AMD published an...
Dow Electronic Materials Wins Prestigious R&D 100 Award for SOLDERON™ Tin-Silver Plating ChemistryNov 19, 2015 · By Dow Electronic Materials · Press Releases MARLBOROUGH, Mass. – Nov. 17, 2015 – Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today...
Technology Updates at ECTC 2013Jun 07, 2013 · By Francoise von Trapp · 3D Event Coverage The ECTC 2013 stats are in. This year showed increases across the board with: Over 1,300 attendees, the highest attendance...
Rudolph Acquires Assets of Tamar TechnologiesApr 29, 2013 · By Francoise von Trapp · Press Releases Rudolph Technologies, Inc., known for its process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries,...
Amkor Sets the Bar with Fine-Pitch Cu PillarsSep 17, 2010 · By Francoise von Trapp · Blogs I love field trips. This week, I took one over to historic old town Chandler, AZ, where IMAPS Arizona chapter...