Latest Posts
IFTLE 641: Is the CHIPS Act Becoming the CHIPS Investment Act?
Plus: TSMC Packaging in AZ; Deca/Microchip/SST Non-volatile Memory Packaging Taiwans Minister of Economic Affairs reports that he received information about...
IFTLE 634: Micron Invests Onshore; TSMC CoPoS
Micron Expands Investment In IFTLE 631 we asked whether any other companies would up their own investments to onshore chip...
IFTLE 631: CHIPS Act Now Under U.S. Investment Accelerator
The U.S. Investment Accelerator was officially established on March 31, 2025, as part of an effort to modernize the investment...
IFTLE 629: GlobalFoundries New York Advanced Packaging and Photonics Center
Earlier this year GlobalFoundries (GF) announced a New York Advanced Packaging and Photonics Center (NY APPC) billed as “…the first...
Natcast Announces Inaugural NSTC Technical Advisory Board
Leading experts spanning the U.S. semiconductor ecosystem will provide strategic guidance and expertise to help shape NSTC Research Agenda, advance...
IFTLE 625: If Intel Ohio is on Hold – Do They Still Get CHIPS Act Funds?
An aerial view from February 2024 shows construction progress at Intel’s Ohio One campus of nearly 1,000 acres in Licking...
The Funds Keep on Rolling for CHIPS for America R&D
The CHIPS Act continues to issue grants to help advance the United States position in semiconductor and advanced technology. Two...
ASU’s SWAP Hub and National Collaborations Shape U.S. Microelectronics Leadership
In August of 2023, I attended the inaugural meeting of the Southwest Advanced Prototyping (SWAP) Hub, spearheaded by the Ira...
Biden-Harris Administration Awards nearly $5 million to Small Businesses to Bring New CHIPS Technology to the Commercial Market
Department of Commerce Announces Grants Across Nine States Highlight Thriving U.S. Semiconductor Industry Today, the Biden-Harris Administration awarded nearly $5...
IFTLE 601: Glass Substrates for CPUs; Silicon Interposers; and 300mm Wafer Production in the U.S.
AMD to Adopt Glass Substrates for CPUs Business Korea reports that AMD intends to adopt glass substrates for its ultra-high-performance... IFTLE 600: A Notice of Intent from the CHIPS NAPMP
The National Advanced Packaging Manufacturing Program (NAPMP) is one of multiple CHIPS R&D initiatives that seek to create United States...
IFTLE 598: NSTC Update
In February 2024, CHIPS announced that $5B would be spent in the National Semiconductor Technology Center (NSTC) to drive innovation...
IFTLE 591: TSMC AZ & Samsung get CHIPS Money; IMAPS Hosts 2nd Annual Onshoring Conference
We all knew it was coming….it was just a matter of time until it was announced. The Department of Commerce...
IFTLE 589: Intel Gets CHIPS Act Funding; Raytheon and AMD Partner on Multi-Chip Package
The Department of Commerce (DoC) has announced Intel as the fourth program it will fund under the CHIPS and Science...
IFTLE 552: CHIPS Industrial Advisory Council (IAC) Update
CHIPS Announces Details on Funding Opportunity Timing The Department of Commerce (DoC) has announced details regarding funding opportunities and application...
U.S. Department of Commerce Appoints Brewer Science Executive to Chips Act Advisory Committee
Brewer Science commends Ken Joyce for appointment to the DOC Industrial Advisory Committee, advising CHIPS for America R&D efforts. ROLLA,...
SEMI Applauds Final Passage of CHIPS and Science Act of 2022
MILPITAS, Calif. — July 28, 2022 — SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded...
IFTLE 396: DARPA Envisions CHIPS as New Approach to Chip Design and Manufacturing
First a word on the change in venue… After working with Pete Singer at Solid State Technology from 2010-2018 and...
Hey Data Guys, Show Us the Money!
I spent last week attending two separate events: the opening of the Center for Heterogeneous Integration and Performance Scaling (CHIPS)...