Francoise von Trapp (aka the Queen of 3D) has been following and reporting on the progress of 3D integration technologies since 2009. Francoise in 3D provides a high-level perspective of 3D industry events, offers executive viewpoints, and focuses on process and manufacturing aspects of 3D integration.
Inspiring the Semi Industry’s New Frontier
Last week I attended SEMICO’s Research Summit, in Scottsdale, AZ, and was fortunate to hear some high-level industry executives discuss the emerging landscape of the semiconductor industry, and 3D integration’s role in it. What was most interesting was the resounding call across the board for collaboration across the supply chain,...
Changes are Afoot at 3D InCites
I knew we were onto something when Leo Archer and I chose 3D ICs and 3D packaging as the top of focus two and a half years ago when we first launched 3D InCites. The intention was to play off the word “incite” was to stir up interest in this...
Walker’s 2011 Forecast: After the 2010 Boom – Now What?
What the room heard: Get ready for a second downturn. DRAM is in the tank because PC production is down, causing ASP price erosion. All sorts of indicators mean that the semiconductor industry isn’t out of the woods yet. What I heard: The sweet spot for growth is being driven...
NEXX Celebrates 10 Years of Success
NEXX Systems' 10th Anniversary celebration dawned sunny, warm and dry, a rare occurrence these days in the Northeast. In fact, the company was taking quite a risk to plan an outdoor celebration, regardless of the tent. But that pretty much describes the company’s overall approach to business, and why they’ve...
SPTS – It’s all in the Timing
One year ago today, I was sitting with David Butler and Kevin Crofton, of SPTS, at the company headquarters in Newport, Wales, talking about the whirlwind year they’d just had, how well the company was doing since the merger of STS and Aviza, and the advantages of being part of...
Hey Intel, get your own buzzword…
So there I was, listening to Eric Beyne talk about the importance of co-developing advanced CMOS and 3D ICs because one directly affects the other, when my thoughts turned to once again to FinFets (is this what he means by advanced CMOS?) I wondered whether these so-called 3D transistor structures...
The SEMICON West Reception Crawl
Yes, there were lots of great conference sessions, keynotes, and products and technologies being showcased at SEMICON West 2011 (I have the notebook full of notes to prove it) but everyone knows that the measure of a truly successful SEMICON West lies in the network opportunities and the receptions following...
IWLPC in 3D
I just got back from the IWLPC 2011 in Santa Clara, and my head is full of commentary just begging to be dumped on a page. This year’s agenda was jam packed with 3D discussion — plenary talks by Matt Nowak of Qualcomm and John Lau of ITRI, a panel...
Cost of 3D Test: Could it be a Showstopper for TSVs?
You all know I hate to be the bearer of bad news, but I’ve been talking to Al Crouch, Chief Technologist, Core Instruments at ASSET InterTech, and he has some grave concerns that ultimately the cost of test, if not handled properly, could kill 3D TSV integration. On the bright...
Pistorio for President
If anyone could give President Obama a run for his money in 2012, I think it might just be Pasquale Pistorio, honorary chairman of ST Microelectronics. He's worked with the company since its establishment in 1987 until his retirement in 2005. During his closing remarks at Leti's Annual Research Reviews...
