One of the largest industry conferences in Europe, SEMICON Europa will focus on emerging 3D IC technologies. Throughout the conference multiple technical sessions, keynote presentations, and exhibitors will discuss all aspects of 3D products, technologies, and solutions. These aspects include design, device fabrications, packaging, and test.
Wednesday, October 9, session 4 will focus on 3D Packaging, with presentations on an alternative Package-on-Package technology developed at SPIL; a look at thin glass foils for electronics encapsulation, and assembly and interconnect solutions fro 3D applications.
Also on Wednesday afternoon, A 3D TSV Session recapping the “best of” the 3D TSV Summit 2013 will be held, discussing 3DIC marketing trends and evolutions. Christoph Fitamant, of Yole Developpment and Jan Vardaman, TechSearch International, will each present 3D IC market trends. Additionally, representatives from CEA-Leti, Yole, Fraunhofer IZM, Multitest, and others will speak during the session. Semi Europe’s Yann Guillou will present a preview of what’s to come at the European 3D TSV Summit 2014. Register here to secure your spot.
