Blogs Archives - Page 2 of 85

3D In Context View all

Memories, IEDM, and Looking Forward

Dec 19, 2025 · By Dean Freeman · 3D In Context

How to start what is potentially my final blog for 3D InCites: Memories, So Long, Farewell, (that one might get me in trouble), or Back to the Future? I started this venture at SEMICON West in 2019, where I helped Françoise cover the show and wrote my first 3D InCites...

SEMICON West Navigates Semiconductor Industry Changes

Nov 18, 2025 · By Dean Freeman · 3D In Context

As Benjimen Franklin said, shortly after the US Constitution was written, “In this world, nothing can be said to be certain, except death and taxes.” I’ll add one comment to that: Change. Change is constant. Over the past year, there has been a significant amount of change in the semiconductor...

Advanced Packaging: A Community Coming Together

Nov 12, 2025 · By Dean Freeman · 3D In Context

In the past 16 years, 3D InCites has watched the 3D packaging industry grow. The philosophy of 3D InCites was to create an advanced packaging community. At SEMICON West in Phoenix, the community was out in force, from ribbon-cutting ceremonies for new facilities, to new packaging equipment companies showing for...

The 3DICAMA and Other Efforts to Develop the 3D IC Ecosystem

Oct 14, 2025 · By Dean Freeman · 3D In Context

This Fall has been a busy time for semiconductor events. Starting with SEMICON Taiwan at the start of the month, IMAPS in Late September into early October, followed closely by SEMICON West last week. Fortunately, there is a month off to catch your breath before heading to Semicon Europa. There...

Francoise in 3D View all

Passing the Torch: Reflections from SEMICON Europa 2025

Nov 24, 2025 · By Francoise von Trapp · Blogs

While announcing my retirement after 20 years in the industry at IMAPS Symposium brought my career in advanced packaging full circle, wrapping up my 3D InCites career at SEMICON Europa brought closure. It was at SEMICON Europa 2007, held in Stuttgart, where my fascination with 3D integration and packaging first...

Francoise Unfiltered: Thoughts from IMAPS Symposium and SEMICON West

Oct 15, 2025 · By Francoise von Trapp · Blogs

Maybe it’s my impending retirement, but I’m feeling a little salty these days. This my fifth draft about the highlights, low-lights and Aha moments of both IMAPS Symposium and SEMICON West. And I can’t get it right. All that comes up is my annoyance with carefully crafted messaging because nobody...

Changes at 3D InCites: Here’s What You Need to Know

Oct 01, 2025 · By Francoise von Trapp · Blogs

I recently realized that IMAPS Symposium 2025 marks my 20th anniversary in the microelectronics industry. It was the first industry event I attended, as the Associate Editor of Advanced Packaging Magazine. My first SEMICON West was in 2006, and my first SEMICON Europa was in 2007. That was when I was first...

IMAPS Executive Summit: Advanced Packaging Comes to Silicon Valley

Sep 29, 2025 · By Francoise von Trapp · Blogs

To celebrate the re-boot of Silicon Valley’s IMAPS Chapter, Chair Rozalia Beica, Rapidus, conceptualized and launched – with the help of the local committee and the IMAPS team – the first ever IMAPS Executive Summit. The theme was Advanced Packaging 2025: Market Momentum & Investment Outlook. According to Beica, what...

From Different Dimensions View all

December Monthly News: That’s a Wrap on 2025

Dec 23, 2025 · By Camden McCrea · Blogs

December 2025 was an action-packed month for the 3D InCites community and the semiconductor industry. Major leadership appointments, innovative technology launches, and global collaborations highlighted the month. Advances ranged from AI-powered process optimization and hybrid bonding production to new materials and solder solutions. Industry events showcased cutting-edge manufacturing experiences and...

Sustainability 101: Farewell From Julia

Dec 17, 2025 · By Julia Freer · Blogs

It’s bittersweet to be writing my last blog post for 3D InCites after 50+posts over four and a half years. My professional relationship with Francoise goes back much further to when we were both at Advanced Packaging Magazine 20 years ago. In Dec of 2015, Francoise approached me about writing...

Reflections on My Year as the 3D InCites Editorial Intern

Dec 10, 2025 · By Camden McCrea · Blogs

Over the past year, my role as the 3D InCites editorial intern has given me a front-row seat to one of the most dynamic corners of the semiconductor world: advanced packaging and heterogeneous integration. My duties spanned writing Member Monthly News, creating LinkedIn content, contributing feature articles, and even representing...

November Member News: Shaping the Future of Semiconductors

Dec 02, 2025 · By Camden McCrea · Blogs

November was a dynamic month for the 3D InCites community and the broader semiconductor industry, with companies showcasing innovative technologies, celebrating leadership achievements, expanding global operations, and advancing workforce development. From product launches and AI‑enhanced design platforms to award recognitions and strategic partnerships, industry leaders highlighted breakthroughs in advanced packaging, inspection,...

Interconnectology 101 View all

My Message for the Advanced Packaging Industry

Dec 16, 2025 · By Jillian McNichol · Interconnectology 101

Since 2009, when Francoise started 3D InCites, she’s been sharing her insights on advanced packaging – an industry, she told me, that people used to dismiss. “Back then, advanced packaging was still seen as a cost-adder, versus adding value through enhanced performance.” she said. So much has changed since then....

The EU’s Semiconductor Strategy: CHIPS Act 2.0, Investments, and More

Dec 03, 2025 · By Jillian McNichol · Interconnectology 101

I recently attended SEMICON Europa in Germany to learn how the EU is approaching the next phase of its semiconductor development. From what I learned, the EU is moving its industry forward by planning for its CHIPS Act 2.0 legislation, attracting new investments, and funding competitive R&D pilot programs. In...

Co-Packaged Optics: Today’s Biggest Packaging Push

Nov 26, 2025 · By Jillian McNichol · Interconnectology 101

Co-packaged optics is one of the most talked about innovations in advanced packaging right now, and it’s for good reason. It promises higher bandwidth density, lower power consumption, and reduced latency over other packaging approaches – all of which are essential for enabling smarter AI solutions. To learn more about...

Will AI Ever Become Profitable?

Nov 04, 2025 · By Jillian McNichol · Interconnectology 101

Last year, I wrote a blog on the growth of AI, where I broke down the public hype around the technology and the barriers preventing it from scaling further. Earlier this year, Gartner projected that worldwide AI spending will reach $1.5 trillion by the end of 2025, up $490 billion...

Packaging IFTLE View all

IFTLE 651: Intel and Amkor Join Forces for EMIB

Dec 22, 2025 · By Phil Garrou · Blogs

Amkor and Intel report that they are teaming up for Amkor high volume manufacturing (HVM) of EMIB due to “interest from the AI Industry.” Through this agreement, Amkor will implement EMIB assembly processes at its Korea, Portugal and upcoming Arizona manufacturing facilities, creating an alternative source for this advanced packaging...

IFTLE 650: Tax Credits for Materials Suppliers; Amkor Automotive

Dec 15, 2025 · By Phil Garrou · Blogs

SEMI Investment Act Tax Credit to Include Materials Suppliers SEMI, the industry association, has announced support for the introduction of the Strengthening Essential Manufacturing and Industrial Investment Act (the SEMI Investment Act) which would extend the Advanced Manufacturing Investment Tax Credit established under the U.S. CHIPS and Science Act through...

IFTLE 649: Let the Hybrid Bonding Wars Begin! Also: Samsung Locks in Glass Interposer Source

Dec 08, 2025 · By Phil Garrou · Blogs

Adeia vs AMD Hybrid bonding is a semiconductor packaging technique that enables direct Cu-Cu and oxide-to-oxide connections, eliminating the connection using microbumps. This approach improves interconnect density, electrical performance, and thermal efficiency, making it an important advanced packaging technology for next-generation semiconductor devices. Adeia Semiconductor Solutions, a wholly owned subsidiary...

IFTLE 648: Unimicron Glass Core Substrates and Hybrid Bonding

Dec 01, 2025 · By Phil Garrou · Blogs

With all the hype surrounding the potential use of glass interposer substrates and hybrid bonding, I thought taking a deep dive look at the recent publication “Flip Chip on Glass Core Substrates with Microbump and Cu-Cu Hybrid Bonding” ,which appeared in the IMAPS Journal of Microelectronics and Electronic Packaging, by...

Blogs

3D InCites Grows Up: Passing the Torch

IFTLE 652: The End……….

Beyond Transport Modes: Balancing Cost and Speed in Semiconductor Logistics

3D In Context View all

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From Different Dimensions View all

Interconnectology 101 View all

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