3D InCites Launches WeChat Platform
Jun 10, 2021 · By Ina Chu · From Different Dimensions
Latest Posts - Page 2
How we Helped a Customer Deliver a GEM-compliant Equipment using CCF
Welcome to the first posting in the Cimetrix CIMControlFramework (CCF) Services blog series! While Cimetrix has been providing professional services...
Semiconductor Back End Processes: Selective GEM300 Adoption
GEM and GEM300 Adoption In a previous blog, I shared how the relatively new SEMI task force in North America called...
How to Create a Vibrant Semiconductor Manufacturing Industry in the United States
Having spent the last 30 years working in semiconductor manufacturing, it is both exciting and unsettling to see renewed political...
SEMICON China – An Exhibitor Perspective
After the cancellation of SEMICON Korea in January, not many were surprised to learn that SEMICON China would not take...
SEMICON China 2020 at a Glance
SEMICON China 2020, collocated with FPD China, was successfully held June 27-29, 2020. SEMICON China was the first big semiconductor...
VLSI 2020: 3D Continues to Dominate Advanced Semiconductor Technology
As a process geek, The Symposia on VLSI Technology and Circuits has long been one of my favorite conferences. The...
Industry Outlook: What Goes Down Must Come Up
The GDP is down, the stock market is up, unemployment, at least in the USA, is confused, so what is...
Semiconductor Backend Processes: Additional SEMI Standards Related to GEM
Background In a few previous blogs, I shared how the relatively new SEMI Advanced Backend Factory Integration (ABFI) task force...
Stay Virtually Connected with Your Industry Colleagues and Favorite Topics at ECTC 2020
On behalf of the entire Program and Executive Committees, it is my pleasure to invite and welcome all of you...
I’m Not Thrilled to Write this Blog Post
One of the ongoing travesties in public relations? Press release quotes. Looked upon as a necessary evil by most writers,...
TSMC Tales: Building 5nm Fab in Arizona; Cancelling New Huawei Orders
Lots of news over the weekend regarding TSMC. The big news is that TSMC is projected to build its first...
Temporary Wafer Bonding System Is Based On Electrostatics, Not Adhesives
Temporary wafer bonding is widely employed in semiconductor device fabrication and in semiconductor device packaging applications, particularly now that changes...
Chiplets: The New Era Begins
The semiconductor industry has entered a new era and the role of design including the package has become increasingly important....
Chiplets Promise to put Moore’s Law Back on Track
Moore’s Law may not be dead, but at 55 years old, it’s certainly feeling its age, with the pace of...
Commerce Department Tightens the Screws on the US Semiconductor Industry
On April 28, the commerce department issued the following news release that could deeply impact the US semiconductor industry: “The...
Six Ways to Repurpose Your Tradeshow Investment
Like all global industries, the tech industry is being challenged in unprecedented ways as the outbreak of the novel coronavirus...
Recent Achievements in SEMI Standards
The first SEMI Standards Committee was formed in 1973 to address silicon wafer dimensional specifications. At the time, there was...
Semiconductor Industry Collaboration Becomes More Critical as Technologies Converge
Perhaps more than at any point in the history of the semiconductor industry, the manufacturing and design supply chain is...
COVID-19 and Semiconductor Recovery: What Does the Future Hold?
While the fog surrounding COVID-19 is still heavy out there, over the past week it has started to clear enough...