IEDM 2019: Innovative Devices for an Era of Connected Intelligence
Dec 16, 2019 · By Dean Freeman · Blogs, From Different Dimensions
Latest Posts - Page 2
The ECTC Time Machine: Lead-free Solder, Environmental Reporting, and Next-Generation Sensors
Attending ECTC 2019 this year was like a trip through a time machine. From my post at the 3DInCites booth,...
Heterogeneous Integration Component Flavors SEMI ASMC 2019
“It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and...
Extending Moore’s Law through Advanced Packaging
The performance and productivity of microelectronics have increased continuously over the last 50 years due to the enormous advances in...
Advanced Heterogeneous Packaging Solutions for High Performance Computing
Heterogeneous integrated circuit (IC) packaging has made a full entrance into the high-performance computing arena. The target applications are broad,...
Advanced Packaging: Game Changer for Semiconductor Revolution
Advanced packaging has entered its most successful era boosted by a need for better integration, the end of Moore’s law...
Thank 2.5D Interposer Technologies for the Success of 3D ICs
Would it be flippant to say that the most pivotal event that impacted the commercialization of 3D integration technologies, may...
MEMS & Sensors Technical Congress Highlights Automotive Market, Emerging MEMS Technologies
This year’s MEMS & Sensors Technical Congress (MSTC), February 19-20, 2019, features a deep dive into the changing automotive sensor...
3D Integration Enables More than Moore Technologies
Looking back at the last 10 years, it is very difficult to choose one single event that was the most...
Breakthroughs in 3D Stacked FinFETS and 3D Sequential Integration
The annual International Electron Devices Meeting (IEDM) presents the latest developments in electronic device technologies focused on advanced scaling, heterogeneous...