SEMI Response to the COVID-19 Pandemic: Supporting Continuity of Members’ Business Operations
Apr 08, 2021 · By Michael Ciesinski · Blogs, From Different Dimensions
Latest Posts - Page 3
2020 Outlook: Optimism Ahead! The Opportunities are There
I am writing this viewpoint while 2019 will close in a couple of days. If I try to summarize what...
Software Testing for Factory Automation
When it is time to deploy equipment in a factory it is very apparent if proper software testing has been...
IEDM 2019: Innovative Devices for an Era of Connected Intelligence
The IEEE International Electronic Devices Meeting (IEDM) been one of my favorite conferences for many years. Early in my career,...
Moore’s Law Rises from the Dead Again Driven by 3D Transistor Technology
At Semicon West in July there was a great deal of discussion that Moore’s Law was dead and would likely...
IMAPS 2019: Stalled Scaling Begets AI Opportunities For Heterogeneous Integration
Chiplets and 5G were a kind of buy-in to play at the IMAPS 2019 Symposium high-stakes table last week in...
Q2 2019: Memory Business is Approaching the Bottom
“Combined DRAM and NAND revenue was US$25.4 billion in Q2 2019, down 5% from Q1 and down 39% year-over-year as...
EPS 2019: Imagining Thomas Edison as the Father of Advanced Packaging
Thomas Alva Edison didn’t invent semiconductor device packaging, but he might have, had he lived just one more generation. “I...
How 3D Keeps the Semiconductor Industry Scaling
Imec did their usual stellar job of demonstrating what needs to happen in the semiconductor manufacturing world to enable the...
TOP 25 OSATs Ranking: Survival of the Fittest?
Out of the top 25 OSATs, Taiwan-based OSATs contributed more than half of the revenue in 2018 followed by China,...
SEMI ASMC 2019: Heterogeneous Integration Enters the Mix
“It’s relatively easy to build a fancy new transistor in the lab, but in order to replace what we’re doing...
The ECTC Time Machine: Lead-free Solder, Environmental Reporting, and Next-Generation Sensors
Attending ECTC 2019 this year was like a trip through a time machine. From my post at the 3DInCites booth,...
Heterogeneous Integration Component Flavors SEMI ASMC 2019
“It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and...
Extending Moore’s Law through Advanced Packaging
The performance and productivity of microelectronics have increased continuously over the last 50 years due to the enormous advances in...
Advanced Heterogeneous Packaging Solutions for High Performance Computing
Heterogeneous integrated circuit (IC) packaging has made a full entrance into the high-performance computing arena. The target applications are broad,...
Advanced Packaging: Game Changer for Semiconductor Revolution
Advanced packaging has entered its most successful era boosted by a need for better integration, the end of Moore’s law...
Thank 2.5D Interposer Technologies for the Success of 3D ICs
Would it be flippant to say that the most pivotal event that impacted the commercialization of 3D integration technologies, may...
MEMS & Sensors Technical Congress Highlights Automotive Market, Emerging MEMS Technologies
This year’s MEMS & Sensors Technical Congress (MSTC), February 19-20, 2019, features a deep dive into the changing automotive sensor...
3D Integration Enables More than Moore Technologies
Looking back at the last 10 years, it is very difficult to choose one single event that was the most...
Breakthroughs in 3D Stacked FinFETS and 3D Sequential Integration
The annual International Electron Devices Meeting (IEDM) presents the latest developments in electronic device technologies focused on advanced scaling, heterogeneous...