From Different Dimensions

Latest Posts - Page 3

Jan 22, 2019 · By Amy Leong · Blogs

When we look back at the last 10 years, it’s really been a series of baby steps to move the...

Jan 11, 2019 · By Paul Werbaneth · Blogs

Paul Werbaneth, Nor-Cal Products The widespread deployment of 3D stacked CMOS Image Sensors (CIS) in consumer electronics, namely smartphones, by...

Jan 10, 2019 · By Yann Guillou

Yann Guillou, Trymax Semiconductor I cannot believe 3D InCites is already turning 10! As wise people say, time flies! Taking...

Aug 06, 2018 · By John Lau · Blogs

Recently, I read a paper published in the 2017 IMAPS Device Packaging Conference proceedings, titled “Cost Comparison of Fan-out Wafer Level...

Mar 26, 2018 · By Doug Anberg · Blogs

Part 1 of this advanced packaging (AP) article series focused on solving photoresist (PR) strip and under bump metallization (UBM)...

Feb 27, 2018 · By Laura Mauer · Blogs

Over the years, the semiconductor industry has relentlessly focused on shrinking gate dimensions to drive performance. This focus has now...

Feb 20, 2018 · By Don Draper

This year’s European 3D Summit in Dresden, which highlighted “Heterogeneous Integration Driving 3D”, was led off by presentations and a...

Feb 19, 2018 · By Pieter Vandewalle

A couple of years ago we may not have predicted that in 2018 there would be a growing demand for...

Feb 12, 2018 · By Eric Beyne · Blogs

2017 saw a clear breakthrough for 3D chip technology in commercial products. Before then, the industry had looked rather...

Feb 01, 2018 · By Robert Kavanagh · Blogs

While the entire semiconductor industry is buzzing about explosive and sustained growth well into the 2020s driven by smart everything...