How to Do Business Virtually: A COVID-19 Success Story
Jan 21, 2021 · By Siemens Digital Industries Software · Blogs, From Different Dimensions
Latest Posts - Page 3
EPS 2019: Imagining Thomas Edison as the Father of Advanced Packaging
Thomas Alva Edison didn’t invent semiconductor device packaging, but he might have, had he lived just one more generation. “I...
How 3D Keeps the Semiconductor Industry Scaling
Imec did their usual stellar job of demonstrating what needs to happen in the semiconductor manufacturing world to enable the...
TOP 25 OSATs Ranking: Survival of the Fittest?
Out of the top 25 OSATs, Taiwan-based OSATs contributed more than half of the revenue in 2018 followed by China,...
SEMI ASMC 2019: Heterogeneous Integration Enters the Mix
“It’s relatively easy to build a fancy new transistor in the lab, but in order to replace what we’re doing...
The ECTC Time Machine: Lead-free Solder, Environmental Reporting, and Next-Generation Sensors
Attending ECTC 2019 this year was like a trip through a time machine. From my post at the 3DInCites booth,...
Heterogeneous Integration Component Flavors SEMI ASMC 2019
“It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and...
Extending Moore’s Law through Advanced Packaging
The performance and productivity of microelectronics have increased continuously over the last 50 years due to the enormous advances in...
Advanced Heterogeneous Packaging Solutions for High Performance Computing
Heterogeneous integrated circuit (IC) packaging has made a full entrance into the high-performance computing arena. The target applications are broad,...
Advanced Packaging: Game Changer for Semiconductor Revolution
Advanced packaging has entered its most successful era boosted by a need for better integration, the end of Moore’s law...
Thank 2.5D Interposer Technologies for the Success of 3D ICs
Would it be flippant to say that the most pivotal event that impacted the commercialization of 3D integration technologies, may...
MEMS & Sensors Technical Congress Highlights Automotive Market, Emerging MEMS Technologies
This year’s MEMS & Sensors Technical Congress (MSTC), February 19-20, 2019, features a deep dive into the changing automotive sensor...
3D Integration Enables More than Moore Technologies
Looking back at the last 10 years, it is very difficult to choose one single event that was the most...
Breakthroughs in 3D Stacked FinFETS and 3D Sequential Integration
The annual International Electron Devices Meeting (IEDM) presents the latest developments in electronic device technologies focused on advanced scaling, heterogeneous...
3D ICs Eliminate the Memory Wall
The adoption of 3D ICs allowed the elimination of the “Memory Wall” using a new memory architecture and through silicon...
Probe Test for 3D Integration: A Thousand Mile Journey
When we look back at the last 10 years, it’s really been a series of baby steps to move the...
3D Powered: From Image Sensors to Artificial Intelligence
Paul Werbaneth, Nor-Cal Products The widespread deployment of 3D stacked CMOS Image Sensors (CIS) in consumer electronics, namely smartphones, by...
3D InCites Turns 10: A Brief Analysis of the 3D Journey
Yann Guillou, Trymax Semiconductor I cannot believe 3D InCites is already turning 10! As wise people say, time flies! Taking...
Perspectives on the Cost of Fan-out Wafer Level Packaging vs. Flip Chip Packaging
Recently, I read a paper published in the 2017 IMAPS Device Packaging Conference proceedings, titled “Cost Comparison of Fan-out Wafer Level...
Advanced Packaging Trends – Part II: Solving Lithography Challenges
Part 1 of this advanced packaging (AP) article series focused on solving photoresist (PR) strip and under bump metallization (UBM)...