3D InCites Launches WeChat Platform
Jun 10, 2021 · By Ina Chu · From Different Dimensions
Latest Posts - Page 3
COVID-19: What Can We Learn from China’s Experience?
Across the world, citizens are settling into a temporary new normal necessitated by efforts to slow the spread of the...
Heterogeneous Integration Technologies for Moore’s Law 2.0 and Beyond
Despite travel restrictions due to the Coronavirus, Dr. Douglas Yu, Vice President of R&D for TSMC gave a keynote via...
Why implement a SECS GEM driver?
A SECS GEM driver can be looked at from a factory or equipment supplier perspective. I will discuss both of...
Big Data and Beyond: PTC Summit Examines AI and ML for Smart City Applications
The problem at its most succinct: “A piece of equipment will deteriorate much more predictably than a human body does.”...
Industry Standards Activity Report November 2019
The SEMI North American standards meetings for the Information and Control Committee were held recently and the following is a...
GEM: Meeting Future Needs by Building on the Stability of the Past
As a young boy, I liked to work on the family car with my dad. He taught me how to change...
Successful Growth in 2020 Calls for a Sustainable Approach
On the whole, 2019 was a very interesting year for the global semiconductor industry. After a record-setting 2018, the market...
2020 Outlook: Optimism Ahead! The Opportunities are There
I am writing this viewpoint while 2019 will close in a couple of days. If I try to summarize what...
Software Testing for Factory Automation
When it is time to deploy equipment in a factory it is very apparent if proper software testing has been...
IEDM 2019: Innovative Devices for an Era of Connected Intelligence
The IEEE International Electronic Devices Meeting (IEDM) been one of my favorite conferences for many years. Early in my career,...
Moore’s Law Rises from the Dead Again Driven by 3D Transistor Technology
At Semicon West in July there was a great deal of discussion that Moore’s Law was dead and would likely...
IMAPS 2019: Stalled Scaling Begets AI Opportunities For Heterogeneous Integration
Chiplets and 5G were a kind of buy-in to play at the IMAPS 2019 Symposium high-stakes table last week in...
Q2 2019: Memory Business is Approaching the Bottom
“Combined DRAM and NAND revenue was US$25.4 billion in Q2 2019, down 5% from Q1 and down 39% year-over-year as...
EPS 2019: Imagining Thomas Edison as the Father of Advanced Packaging
Thomas Alva Edison didn’t invent semiconductor device packaging, but he might have, had he lived just one more generation. “I...
How 3D Keeps the Semiconductor Industry Scaling
Imec did their usual stellar job of demonstrating what needs to happen in the semiconductor manufacturing world to enable the...
TOP 25 OSATs Ranking: Survival of the Fittest?
Out of the top 25 OSATs, Taiwan-based OSATs contributed more than half of the revenue in 2018 followed by China,...
SEMI ASMC 2019: Heterogeneous Integration Enters the Mix
“It’s relatively easy to build a fancy new transistor in the lab, but in order to replace what we’re doing...
The ECTC Time Machine: Lead-free Solder, Environmental Reporting, and Next-Generation Sensors
Attending ECTC 2019 this year was like a trip through a time machine. From my post at the 3DInCites booth,...
Heterogeneous Integration Component Flavors SEMI ASMC 2019
“It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and...