Nordson ELECTRONIC SOLUTIONS

About Nordson ELECTRONICS SOLUTIONS

ASYMTEK Products has advanced fluid dispensing and jetting technologies for over 40 years. As part of Nordson Electronics Solutions, we focus on making reliable electronics a reality with innovative precision dispensing solutions for 2, 2.5, and 3D heterogeneous integration and chiplet architectures in semiconductor manufacturing.

Fluid dispensing has long played an important role in semiconductor packaging applications, providing adhesion, structural integrity, thermal and electrical conductivity, protection, and more. There is constant pressure to increase dispensing productivity in parallel with packaging advancements. As chip populations increase, dispensing applications must deliver tiny fluid amounts precisely and consistently within small form factors and into micron-sized gaps between chips and components. High-speed, precise dispensing is crucial to advance reliability and throughput.

ASYMTEK systems can be tailored for customers’ applications such as capillary underfill for stacked dies with through silicon vias (TSV), face-to-face stacked dies, and flux dispensing for die stacking. Other applications include fluid encapsulation, conductive pastes for die attach, and thermal interface material (TIM) for heat dissipation. Our newest innovations involve to wafer-level and panel-level packaging solutions.

Our manufacturing offers scalable production capacity to meet demand, delivering technology leadership with stable but flexible manufacturing processes. Continuous improvement is driven using disciplined problem-solving and team collaboration. Our facilities in Carlsbad, California, USA are ISO 9001:2015 certified.

Fluid dispensing products for semiconductor packaging:

• The ASYMTEK Vantage® Fluid Dispensing system, our most advanced dispensing platform, is designed for high-end semiconductor packaging and assembly. It’s ideal for advanced assembly technologies that involve high-speed and precise volume dispensing, tight keep-out zones, and dispensing of thin and accurate lines. You will create an unparalleled dispensing process when Vantage is combined with the IntelliJet® Jetting System and Canvas® software.
• The ASYMTEK Forte® Series Fluid dispensing system offers exceptional dispensing productivity and accuracy for high-volume consumer electronics, printed circuit board assembly, flexible circuits, MEMs, and electromechanical assembly applications. Next-generation and time-tested capabilities are combined in this upgraded system to increase productivity by up to 50% over the top-selling Spectrum® ll. Improve UPH with swift acceleration, enhanced motion control, and IntelliJet® compatible Forte MAX dual-valve dispensing.
• The Spectrum® II S-900 Series Fluid Dispensing system is one of the world's most popular fully automated fluid dispenser for high quality and yield through dispense accuracy and process controls. The system is used for applications including wafer-level packaging and underfill.