Francoise News - Page 53
Elpida, PTI, and UMC Partner on 3D IC Integration Development
Elpida Memory Inc., Powertech Technology Inc. (PTI), and United Microelectronics Corporation (UMC), have entered into a 3-way cooperation to advance...CMP/CMC/MOSIS partner to introduce a 3D-IC process
CMP/CMC/MOSIS announced a Grenoble-France based partnership for a 3D-IC multi-project wafer (MPW) service based on Tezzaron’s SuperContact technology and...
Alchimer Introduces Via Fill Technology
Alchimer S.A. has announced a groundbreaking advanced technology for filling narrow, high-aspect-ratio TSVs while significantly reducing...Boooooo to the Naysayers
Ok, I’m annoyed. I just read an article (thanks for pointing me to it Gretchen Patti) that appeared last week...Strategic Restructuring of the SUSS MicroTec Group
SUSS MicroTec has announced its decision to relocate its Substrate Bonder division...ECTC 2010 Panel Examines the Medical Device Market
Keith Cooper, Technology and Development, SET North America reports from ECTC 2010's Medical Device Market Panel, offering a view beyond...EDA Vendors; Ramped and Ready for 3D
Due to extenuating circumstances, (Ok, truth: I’d just returned from a much needed 2 week vacation) I was unable to...CEA-Leti and Docea Power to Combine Expertise on 3D Integration, Thermal and Low-power Design
French research insitute, CEA-Leti and Docea Power, developers of software for power and thermal analysis at the architectural level,...
Diving into the deep end of the 3D ocean
I approached the IEDM 2011 conference, in (San Francisco this week) with much trepidation. Surely, most of these presentations would...CEA-Leti and SPTS to Collaborate On Next-Generation TSV Development
CEA-Leti and SPP Process Technology Systems (SPTS) have agreed to develop advanced 300mm through-silicon via (TSV) 3D-IC processes at CEA-Leti’s...EV Group Introduces New EVG610 Mask and Bond Aligner Optimized for Greater Cost and Process Flexibility
New System Provides World-class Alignment Technology at an Affordable Cost
3D InCites Turns One
Happy Birthday to US! Happy Birthday to US!! Happy BIRTHDAY, 3D InCites….. HAPPY BIRTHDAY TO US!
Wafer-Level Camera Manufacturer, Nemotek Technologie, selects EV Group’s Solutions for Capacity Ramp
Follow-on Order Demonstrates the Strength of EVG’s High-volume Manufacturing Solutions for Wafer-level Camera ApplicationsFunding for 3D R&D – show us the money
As the whole world attempts to climb out of the economic hole it finds itself in, I’m curious about the...Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability
New Realities for TSV Processing
In this article, published in the May/June 2010 issue of Chip Scale Review Magazine,...OSEO assigns 9M Euro to support CUIVRE Project
Smart Equipment Technolgy (SET), Replisaurus Mastering, and research partner, A 3D Field of Dreams
If you build it, they will come. That’s the message Ray Kinsella heard in the movie, Field of Dreams. I...Passing of the Baton
I received a press release from MCA Public Relations today announcing the new leadership team, in light of the sudden...
