Francoise News - Page 13
ECTC 2018 To Focus on Heterogeneous Integration for Artificial Intelligence, Wearables, and More
Did you get your ECTC Advanced Program and Registration in the mail yet? Mine arrived yesterday, and I was pleased...
Hybrid Bonding: From Concept to Commercialization
Hybrid bonding is quickly becoming recognized as the preferred permanent bonding path for forming high-density interconnects in heterogeneous integration applications,...
Let’s Face It, The Business of Self-driving Cars is About Profit, Not Saving Lives
How does the innovation of self-driving cars affect the business world we live in? This was the topic the iMAPS...
Taking Stock and Redefining the Heterogeneous Integration Roadmap at IMAPS DPC 2018
As it has for the past 14 years, the global microelectronics industry gathered at Wekopa Resort and Conference Center in...
2018 3D InCites Awards Ceremony Raises $5500 for Children’s Health and STEM Education
March 7, 2018, the day of the 2018 3D InCites Awards Ceremony, dawned chillier than normal for this time of...
Announcing the Winners of the 2018 3D InCites Awards
We are pleased to announce the winners of the 2018 3D InCites Awards, sponsored by KLA-Tencor and EV Group and...
Living the Dream at SEMI’s Industry Strategy Symposium
As I noted in my day one coverage of SEMI’s Industry Strategy Symposium (ISS 2018), which took place last week...
Notes from SEMI’s ISS 2018, Days 2 and 3
The remaining two days of SEMI’s ISS 2018 dawned foggy and damp, making it a heck of a lot easier...
Notes from SEMI’s ISS 2018, Day One
SEMI’s Industry Strategy Symposium (ISS) has been on my conference bucket list for some time, so when I was offered...
Holiday Greetings from 3D InCites!
Did you ever wonder how much easier Christmas Eve would be for Santa in a world enabled by heterogeneous integration?...
The Truth About Moore’s Law is Revealed at 3D ASIP 2017
I’ve long held the belief that when it comes to reading scholarly works, very few people read the entire paper....
3D InCites and IMAPS International Partner to Co-host the 2018 3DInCites Awards at the 2018 IMAPS Device Packaging Conference
Burlingame, California – Dec. 6, 2018 – 3D InCites, the premier content platform for heterogeneous integration technologies, today from the...
When It Comes to Robots and AI, We Draw the Line at Beer
As one of the current key drivers of the semiconductor industry, the development of robots with artificial intelligence has been...
The Future of Automotive Electronics from the European Perspective
From the keynotes to the sessions to casual conversation, automotive electronics was a hot topic of discussion at SEMICON Europa...
SEMICON Europa 2017: Connect, Collaborate, Innovate, Grow and Prosper
I remember the day I became Queen of 3D like it was yesterday: It was 2007 and I was attending...
Technical Tidbits from IWLPC and MSEC 2017
It’s been a busy few weeks for me as I attended both the International Wafer Level Packaging Conference (IWLPC), October...
Dinner Conversation at the MEMS and Sensors Executive Congress (MSEC17)
One of the things I like best about the annual MEMS and Sensors Executive Congress (MSEC17) hosted by SEMI-MSIG, is...
Smart Factories: Is the Semiconductor Industry Practicing What it Preaches?
I’ve often found it somewhat ironic that those responsible for dreaming up and building the technologies that made smart devices,...
