Plainview, N.Y. — Veeco Instruments Inc. (NASDAQ: VECO) today announced that a world leading semiconductor supplier has qualified Veeco’s WaferStorm® Wet Processing System for advanced packaging applications that will support next generation high bandwidth memory (HBM).
The customer also operates Veeco’s AP300 Lithography Systems for advanced packaging production used to meet demand for 5G system-on-a-chip, graphic processors (GPUs) and high-performance computing applications.
“This qualification of the WaferStorm system was based on best-in-class wet processing technology,” commented Adrian Devasahayam, Ph.D., Senior Vice President, Product Line Management. “Our wet processing technology enables many leading-edge applications, such as high bandwidth memory and high-performance computing, that require devices made with advanced packaging techniques. As integrated packaging designs continue to gain momentum, customers require cleaning and lithography platforms that can handle all advanced packaging process needs with superior capability at the lowest cost of ownership.”
WaferStorm’s unique ImmJET™ solvent technology provides customers with the best overall process performance, flexibility and production capability in its class compared to conventional batch or spray-only approaches. WaferStorm offers proven, reliable solutions for flux cleaning, photoresist strip, dry film resist strip, via cleans and other advanced packaging processes.
Veeco (NASDAQ: VECO) is an innovative manufacturer of semiconductor process equipment. Our proven ion beam, laser annealing, lithography, MOCVD and single wafer etch & clean technologies play an integral role in the fabrication and packaging of advanced semiconductor devices. With equipment designed to optimize performance, yield and cost of ownership, Veeco holds leading technology positions in the markets we serve. To learn more about Veeco’s systems and service offerings, visit www.veeco.com.
To the extent that this news release discusses expectations or otherwise makes statements about the future, such statements are forward-looking and are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include the risks discussed in the Business Description and Management’s Discussion and Analysis sections of Veeco’s Annual Report on Form 10-K for the year ended December 31, 2020 and in our subsequent quarterly reports on Form 10-Q, current reports on Form 8-K and press releases. Veeco does not undertake any obligation to update any forward-looking statements to reflect future events or circumstances after the date of such statements.