Archives February 2019 - 3D InCites

IFTLE 404: One Micron RDL; FOWLP Die Shift; Antennas for FOWLP

IFTLE 404: One Micron RDL; FOWLP Die Shift; Antennas for FOWLP

In this IFTLE post, we continue our look at presentations from the 2018 EPTC Conference… Ultratech / IMEC / JSR – 1µm RDL Ultratech, IMEC and JSR discussed “One Micron Damascene Redistribution for Fan-Out Wafer Level Packaging using a Photosensitive Dielectric Material”. This study compared the creation of 1.0μm RDL structures by a damascene process utilizing a photosensitive permanent d... »

Advanced Packaging: at the Heart of Innovation

The semiconductor industry showed impressive figures in 2017: +21.6% year-over-year growth to reach about US$ 412 billion. Without any doubt, the industry is entering a new age, where innovation and disruption are the keywords. In addition to mobile, Yole Développement (Yole) analysts identified emerging mega-drivers that are changing our world step-by-step. Big data, artificial intelligence (A... »

Unisem Advanced Technologies Selects Two Veeco Tools to Support Expansion of Fan-out Wafer-level Packaging Portfolio

Unisem Advanced Technologies Selects Two Veeco Tools to Support Expansion of Fan-out Wafer-level Packaging Portfolio

 Veeco Instruments Inc. (Nasdaq: VECO) announced today that Unisem Advanced Technologies Sdn Bhd (UAT) has purchased Veeco’s WaferStorm® single wafer solvent, wet process tool and its AP300™  lithography system to support the growth of its outsourced assembly and test (OSAT) business. One of the first independent wafer bumping service providers in Malaysia, UAT will leverage these tools for... »

MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing

MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will be working alongside our existing sales team and representatives in the region. Dr. Zhou’s deep knowledge of the photonics market and his extensive network in the Chinese market will help drive MRSI’... »

MEMS & Sensors Technical Congress Highlights Automotive Market, Emerging MEMS Technologies

MEMS & Sensors Technical Congress Highlights Automotive Market, Emerging MEMS Technologies

This year’s MEMS & Sensors Technical Congress (MSTC), February 19-20, 2019, features a deep dive into the changing automotive sensor landscape, a look at emerging MEMS technologies, and an exploration of integration standards. The more technically focused of SEMI’s annual MEMS events, MSTC returns to Monterey, California, in conjunction with FLEX, the conference that highlights new form fa... »

How Do We Entice Young Women to Pursue Careers in Microelectronics & Packaging?

How Do We Entice Young Women to Pursue Careers in Microelectronics & Packaging?

If what is expressed during ongoing discussions on gender diversity and inclusion at semiconductor and packaging industry events is true, then the overarching belief is that women are drawn to careers that help people. In science, they want to be doctors or researchers to find cures for cancer. It’s also been noted that the younger generation, in general, is interested in the societal benefits o... »

3D Integration Enables More than Moore Technologies

3D Integration Enables More than Moore Technologies

Looking back at the last 10 years, it is very difficult to choose one single event that was the most pivotal for commercializing 3D integration technology. There have been many prior events that have driven 3D integration and aligned the whole industry in migrating from monolithic 2D to heterogeneous and 3D integration. From my perspective, the most path-breaking event was the rise of the backside... »

DesignCon 2019 Shows Board and System Designers the Benefits of Advanced IC Packaging

DesignCon 2019 Shows Board and System Designers the Benefits of Advanced IC Packaging

Santa Clara’s Convention Center was home to DesignCon 2019 from January 29-31, 2019. This conference is well known for showing printed circuit board (PCB) and system designers the latest technology advances, enabling higher performance and lower power and lower cost solutions. Bootcamps, tutorials, keynotes, and many in-depth technical sessions offered engineers up-to-date information to make th... »

Advice on Gender Diversity and Inclusion from the Trenches

Advice on Gender Diversity and Inclusion from the Trenches

From the semiconductor industry panels on gender diversity and inclusion and networking receptions to casual lunches and one-on-one interviews, I’ve been listening to women of all levels of experience talk about what brought them to pursue careers in microelectronics and semiconductors. The stories are as varied as the women telling them. In this two-part series, we hear from three women in lead... »