Archives February 2019 - 3D InCites

FLEX/MSTC Keynotes Confirm: Our Customers Need System-level Solutions

FLEX/MSTC Keynotes Confirm: Our Customers Need System-level Solutions

From February 18 to 21, 2019, Monterey, CA, was again the venue for SEMI’s Flexible Hybrid Electronics (FLEX) and MEMS & Sensors Technical Congress (MSTC), conference. As in previous years, the joint keynotes, 2-track technical sessions, and more than 50 exhibitors demonstrated the synergies between these two industry segments and their fast pace of innovation. The entire conference focused ... »

HPC, AI and Datacenters: the 2.5D and 3D Stacking Technologies Playground

HPC, AI and Datacenters: the 2.5D and 3D Stacking Technologies Playground

“2.5D and 3D stacking technologies are the only solutions that meet the required performance of applications like artificial intelligence (AI) and datacenter as of today”, confirms Mario Ibrahim, Technology & Market Analyst from Yole Développement (Yole). Stacking technologies are used in a variety of hardware, including 3D stacked memory, graphics processor units (GPUs), field programmab... »

Heterogeneous Integration Calls for Increased Materials Reliability

Heterogeneous Integration Calls for Increased Materials Reliability

Automotive reliability is a pivotal concern for heterogeneous integration technologies, especially as emerging mission profiles for electric and autonomous vehicles push component lifetimes out by two to three times or more over standard testing regimes. There has been an increasing realization of the importance of chip-package interaction (CPI) as a source of reliability issues in semiconductor a... »

Extending Moore’s Law through Advanced Packaging

Extending Moore’s Law through Advanced Packaging

The performance and productivity of microelectronics have increased continuously over the last 50 years due to the enormous advances in lithography and device technology. Today, these technologies are becoming prevalent in 3D packaging, which further enables advances in integrating various technologies (logic, memory, RF, sensors, etc.) in a small form factor. There are concerns with the sustainab... »

IFTLE 405: DC Hu of SiPlus Classifies Advanced Packaging Technologies at IMPACT 2018

IFTLE 405: DC Hu of SiPlus Classifies Advanced Packaging Technologies at IMPACT 2018

As scientists, we have a tendency to classify and categorize. It’s our way of comparing and contrasting things in our world. Some of these classifications stick and some don’t. For instance at the start of 3D a decade or so ago, Eric Beyne of IMEC laid out a perfectly reasonable classification of 3D structures based on the level of interconnect they were making. [ Link] It made all the sense i... »

KLA Completes Acquisition of Orbotech Ltd.

KLA Completes Acquisition of Orbotech Ltd.

MILPITAS, Calif., Feb. 20, 2019—KLA-Tencor Corporation (NASDAQ: KLAC) today announced the completion of the acquisition of Orbotech Ltd. (NASDAQ: ORBK). “We are very pleased to have completed the acquisition of Orbotech,” said Rick Wallace, president and CEO of KLA. “This new combination extends KLA’s market reach within the electronics value chain, opens new high-growth markets for the... »

Thank 2.5D Interposer Technologies for the Success of 3D ICs

Thank 2.5D Interposer Technologies for the Success of 3D ICs

Would it be flippant to say that the most pivotal event that impacted the commercialization of 3D integration technologies, may have been the commercialization of 2.5D interposer technologies? Arguably, 3D and silicon interposer are very different technologies, with a common denominator that happens to be the through silicon via (TSV). Until Xilinx announced its Virtix-7 2000T in or around 2011, s... »

IFTLE 404: One Micron RDL; FOWLP Die Shift; Antennas for FOWLP

IFTLE 404: One Micron RDL; FOWLP Die Shift; Antennas for FOWLP

In this IFTLE post, we continue our look at presentations from the 2018 EPTC Conference… Ultratech / IMEC / JSR – 1µm RDL Ultratech, IMEC and JSR discussed “One Micron Damascene Redistribution for Fan-Out Wafer Level Packaging using a Photosensitive Dielectric Material”. This study compared the creation of 1.0μm RDL structures by a damascene process utilizing a photosensitive permanent d... »

Advanced Packaging: at the Heart of Innovation

The semiconductor industry showed impressive figures in 2017: +21.6% year-over-year growth to reach about US$ 412 billion. Without any doubt, the industry is entering a new age, where innovation and disruption are the keywords. In addition to mobile, Yole Développement (Yole) analysts identified emerging mega-drivers that are changing our world step-by-step. Big data, artificial intelligence (A... »

Unisem Advanced Technologies Selects Two Veeco Tools to Support Expansion of Fan-out Wafer-level Packaging Portfolio

Unisem Advanced Technologies Selects Two Veeco Tools to Support Expansion of Fan-out Wafer-level Packaging Portfolio

 Veeco Instruments Inc. (Nasdaq: VECO) announced today that Unisem Advanced Technologies Sdn Bhd (UAT) has purchased Veeco’s WaferStorm® single wafer solvent, wet process tool and its AP300™  lithography system to support the growth of its outsourced assembly and test (OSAT) business. One of the first independent wafer bumping service providers in Malaysia, UAT will leverage these tools for... »

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