TechSearch International Analyzes Trends in Packages for AI Applications

TechSearch International Analyzes Trends in Packages for AI Applications

Artificial Intelligence (AI) combines both hardware and software.  TechSearch International’s latest analysis explains the packages behind AI applications. AI accelerators found in datacenters require high-density packages to support logic plus high bandwidth memory (HBM). Many silicon interposer designs are in mass production and Intel’s EMIB is also used.  Package-on-package (PoP) is used for smartphone processors incorporating AI.  FO-WLP and MCeP PoP versions are in production.  A variety of packages including QFNs and WLPs are found in Smart Home Speakers and Hubs.

Package trends for network systems are analyzed, including laminate BGAs with large body size, silicon interposers with TSVs, and Fan-Out on Substrate.  New package options under development include embedded ceramic bridge and organic interposers.

The latest Advanced Packaging Update is a 90-page report with full references and an accompanying set of 46 PowerPoint slides.  The report also examines the growing shortage of components and provides an analysis of OSAT financials.  A section on micro LEDs, stacked CMOS image sensors, and a peek inside Samsung’s latest Galaxy smartphone are included.  A major section of the report examines laminate substrate package design rules and the materials used by each supplier.

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly.  Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis.  TechSearch International professionals have an extensive network of more than 18,000 contacts in North America, Asia, and Europe.  For more information, contact TechSearch at tel: 512-372-8887 or see www.techsearchinc.com.  Follow us on twitter  @Jan_TechSearch