Archives July 2017 - 3D InCites

Xperi Sets Out to Enable Immersive Experiences

Xperi Sets Out to Enable Immersive Experiences

Xperi is a new entity with a complicated back-story, but a pretty cool vision for its future. First, there was Tessera, well-known throughout the advanced packaging sector of the semiconductor industry as an IP-based technology company focused on chip packaging and interconnects that historically licensed its technology know-how and patents. In 2003, the company formed a new parent company –... »

The Brighter Side of SEMICON West 2017

The Brighter Side of SEMICON West 2017

Generally, I avoid reading other journalists’ coverage of events I’ve attended until I’ve had a chance to finish my own coverage. But there it was in my inbox in a recent edition of Semiconductor Packaging News: “Five Takeaways from Semicon” by Semi Engineering’s Mark LePedus. I couldn’t resist. I had to click. I must admit, Mark is more of a hardcore technology journalist than I am,... »

SEMICON West 2017: The Semiconductor Industry at a Young 50

SEMICON West 2017: The Semiconductor Industry at a Young 50

The semiconductor industry is acting quite young for its age. And that’s just not me saying it; over and over again during SEMICON West 2017 I heard some variation of the phrase “We’re just getting started.” What was it that accounted for the upbeat and buoyant mood at SEMICON West 2017 this month, despite Moscone South Hall being a gaping hole clear down to the basement as a result of Sou... »

Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)

Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)

In the first part of this series, I covered the perspectives of dimensional scaling vs. heterogeneous integration based on discussions during SEMICON West 2017. For part two, I spoke with equipment and material suppliers who serve either (or in some cases, both) the front- and back-ends of the semiconductor manufacturing industry, to round out the picture of how the industry-wide shift in focus fr... »

TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends

TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends

Mobile devices, specifically smartphones, represent the single greatest volume driver for MEMS and other sensors today. Sensors found in these products include electronic compasses, motion sensors, barometers, microphones, and fingerprint sensors. Package types include land grid arrays (LGAs), lead frame packages such as QFNs, and wafer level packages (WLPs.). Apple is expected to account for 28 p... »

EMD Performance Materials Announces Comprehensive Materials Solutions for Chip Miniaturization and Smart Packaging

EMD Performance Materials Announces Comprehensive Materials Solutions for Chip Miniaturization and Smart Packaging

  Philadelphia PA, USA, July 10, 2017 – EMD Performance Materials, a leading science, and technology company, today announced its portfolio of materials solutions for advanced semiconductor manufacturing. Megatrends represented by big data, automotive electronics, IoT, and an increased interest in green assembly, is expanding the need for advanced semiconductor processing and novel materi... »

2017 3D InCites Awards Ceremony and Reception: A Retrospective

2017 3D InCites Awards Ceremony and Reception: A Retrospective

Once again this year, the industry came out in full force to honor excellence in heterogeneous integration at the 2017 3D InCites Awards Ceremony and Cocktail Reception to benefit KidSizeCures for childhood cancer. After a brief ceremony during which we presented 11 awards in 10 categories (find out who won here), guests enjoyed good food, drinks, and conversation, as well as some fun activities, ... »

Heterogeneous Integration Versus Dimensional Scaling: One Year In (Part 1)

Heterogeneous Integration Versus Dimensional Scaling: One Year In (Part 1)

Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)At SEMICON West 2016, the big story was the end of the ITRS Roadmap for dimensional scaling according to Moore’s Law and the birth of the Heterogeneous Integration Roadmap (HIR). There were many reasons for this: the cost of continued scaling vs. the reduced performance benefits, the advantages of being able to heterogeneo... »

NXP and Nepes Create Value with their First FO PoP SiP for IoT

NXP and Nepes Create Value with their First FO PoP SiP for IoT

Advanced packaging is a key enabling technology that not only serves as packaging support but also offers more value and cost reduction to the final products. The advanced packaging industry with its 7% CAGR between 2016 and 2022 (in revenues)¹ is undoubtedly a dynamic sector where innovations play a key role. NXP’s SCM-i.MX6Q fan-out package-on-package system-in-package (FO PoP SiP) with boot ... »

Three Patents Granted to Smoltek

Three Patents Granted to Smoltek

Smoltek, a leading Swedish nanotech company in the semiconductor industry, has expanded its patent portfolio in Asia the last month. New patents in Japan and South Korea are important milestones to increase the company’s core patent portfolio footprint on growth methods for nanostructures. “With three new essential Asian patents granted within a month – in South Korea and Japan – w... »

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