Hugo Pristauz Drops the F-bomb at 3D ASIP 2016, You Won’t Believe What Happens Next!
Sorry everybody, but I couldn’t resist this Buzzfeed-esque title, because Besi’s Hugo Pristauz’ unprecedented use of “colorful” language to illustrate the “turbulent plane ride” of ramping thermo-compression bonding die attach to volume production just might go down in history as the most talked (and laughed) about incident at the 2016 3D Architectures for Semiconductor I... »
Recent Comments