Archives September 2015 - 3D InCites

Novati’s Integrated Sensor Platform Brings It all Together

Novati’s Integrated Sensor Platform Brings It all Together

A few weeks ago, Tezzaron announced its latest industry first: an eight-layer 3D IC wafer stack containing active logic, built at its fab, Novati Technologies, a global nanotechnology development center located in Austin, TX.  Novati is clearly on a roll, because today they added another industry first to their product portfolio: an integrated sensor platform that is the culmination of everything... »

The Semiconductor Industry: The Mastery of Time and Volumes

The Semiconductor Industry: The Mastery of Time and Volumes

Since the dawn of the industry, semiconductor companies have developed disruptive technologies and solutions that have met the most ambitious targets. In a dynamic and global marketplace, they anticipate market needs and design and make the right product at the right time. What’s the key to this success? The supply chain might be the answer. Yole Développement (Yole) and Serma Technologies (Ser... »

TSMC’s Grand Alliance: A Powerful EcoSystem

TSMC’s Grand Alliance: A Powerful EcoSystem

On Thursday, September 17, I was invited to attend TSMC’s Open Innovation Platform (OIP) conference, that showed TSMC’s rapid progress and the power of TSMC’s Grand Alliance. As a former Alliance Manager, I really enjoyed seeing how TSMC’s far-reaching vision and strategic alliances, combined with excellent execution and customer service, made them the largest wafer supplier to fabless IC ... »

Rudolph Acquires Inspection Technology  of Stella Alliance, LLC

Rudolph Acquires Inspection Technology of Stella Alliance, LLC

Flanders, New Jersey (September 29, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has purchased Stella Alliance, LLC, a Massachusetts-based semiconductor inspection technology intellectual property (IP) portfolio company. Stella Alliance’s patented illumination, auto-focus and image acquisition technology significantly enhances the ability to identify certain critical d... »

Executive Viewpoint: MEMS from Automotive to Consumer Electronics to IoT and Back

Executive Viewpoint: MEMS from Automotive to Consumer Electronics to IoT and Back

According to Eric Mounier, of Yole Développement, over the past 15 years, the MEMS market has grown from 15M units to 5B units, driven first by the automotive market to comply with safety regulations, and then by consumer electronics due to the added functionalities in smartphones that require accelerometers, gyroscopes, and geo-magnetic sensors. Mounier says that the next big thing could be auto... »

SUSS MicroTec Receives Large Volume Order for Lithography Projection Scanners

SUSS MicroTec Receives Large Volume Order for Lithography Projection Scanners

Garching, September 24, 2015 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, has received an order for multiple SUSS MicroTec Photonic Systems lithography tools in Q3 2015 from a leading semiconductor manufacturer. The strategically important order includes multiple DSC300 Gen2 projection scanners, which are produced at t... »

Is the IoT Headed for the Trough of Disillusionment?

Is the IoT Headed for the Trough of Disillusionment?

No SEMI Summit would be complete without a lively panel discussion that puts industry experts in the hot seat. The panel at the first SEMI European MEMS Summit, titled IoT Beyond the Hype: What are the Hard Facts?, didn’t disappoint for much as what was discussed, as for what was glossed over; and the ongoing discussion that ensued. Moderated by Jérémie Bouchaud, HIS, the panelists included: ... »

2015 European MEMS Summit:  Are we Living La Vida Loca or La Dolce Vida?

2015 European MEMS Summit: Are we Living La Vida Loca or La Dolce Vida?

Last week, (September 18-19, 2015) SEMI Europe hosted its first-ever European MEMS Summit, in Milan Italy. It was a fitting host city for several reasons; first, the nearby EXPO 2015, which focused on Feeding the Planet – Energy for Life, inspired the theme of the MEMS Summit: “Sensing the Planet, MEMS for Life.” Second, it seemed that in comparison to the semiconductor industry, which calls... »

SUSS MicroTec Launches XB8 – a New Semi-Automated High-Force Wafer Bonder

SUSS MicroTec Launches XB8 – a New Semi-Automated High-Force Wafer Bonder

Garching, September 17, 2015 – SUSS MicroTec, a global supplier of equipment and applications for the semiconductor industry and related markets, has launched the new bonding platform XB8 today. The XB8 wafer bonder is designed for a wide range of bonding processes. It supports substrates with a wafer size of up to 200mm. Key process parameters can be adjusted in a wide range, which makes the sy... »

MEMS Technology for your Senses: What can you Expect?

MEMS Technology for your Senses: What can you Expect?

LYON, France – September 11, 2015 — Hearing, touching, smelling and seeing… what will be the next improvement that MEMS technology will bring to our senses? Sensors are now small enough, reliable enough, and accurate enough to be included in a pocket-sized device of only 9cm³ and become the interface with the environment, details Yole Développement (Yole) in its latest report dedicated to... »

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