Archives February 2013 - 3D InCites

2013 Predictions for 3D ICs as reported by SPN

2013 Predictions for 3D ICs as reported by SPN

While most of the semiconductor trade publications wrapped up their 2013 prediction posts by mid January, Semiconductor Packaging News (SPN) forged on with its original annual Viewpoints series right up until last week. I spent some time pouring over the musings of industry executives’ contributions. Many discuss the proliferation of mobile devices driving technology requirements and 3D ICs as ... »

3D IC Blogosphere Update – Feb 22

Has it really been a month since the European 3D TSV Summit? This inaugural event certainly caused a buzz in the blogosphere! In addition to all my coverage after having attended the event, Phil Garrou has been slogging his way thorough the proceedings to provide an in-depth review on Insights from the Leading Edge. I think he’s up to Part 3. Additionally, iMicronews offered “a closer look” ... »

Sitaram Arkalgud: Going the Distance with 3D ICs

Sitaram Arkalgud: Going the Distance with 3D ICs

Since the early days of 3D InCites, as a member of our technical advisory board, Sitaram Arkulgud has been one of my go-to guys when I had a question about various 3D processes and technologies. There are few people in this industry that have been as enthusiastically optimistic as I am that 3D ICs will be commercialized; and Arkalgud actually knows what he’s talking about. As director of Interco... »

3D IC Gets a Nod or Two of Encouragement at Common Platform Tech Forum 2013

3D IC Gets a Nod or Two of Encouragement at Common Platform Tech Forum 2013

Guest Blogger, Paul Werbaneth, shares his take-aways on 3D ICs at the last week’s Common Technology Platform There was little advance promotion of 3D IC topics at the well-promoted Common Platform Tech Forum 2013 event, held this year at the Santa Clara (CA) Convention Center on Tuesday 05 February 2013, but I figured that, just like Gary Larson’s famous dog Ginger, my selective hearing on... »

3D TSV Summiit

European 3D TSV Summit: But Wait, There’s More!

Day Two of the European 3D TSV Summit dawned bright and clear, with such a spectacular view of the nearby French Alps that it took real commitment to stay indoors and focus on the task at hand. But I have to admit that for the most part, it was worth the sacrifice to hear what this collection of speakers had to say. Georg Kimmich, head of Silicon Packaging R&D at ST-Ericsson delivered a dose o... »

Proof that the  Collaboration Model Works for 3D ICS

Proof that the Collaboration Model Works for 3D ICS

For the past year or so at various conferences, symposiums and summits focused on 2.5D and 3DIC technologies; we’ve been hearing suggestions about business model scenarios. It’s boiled down to three distinct choices. First is a ‘single integration’ model where end-to-end manufacturing takes place in one location – most likely a foundry or IDM. To date, the only foundry in the position to... »

Alchimer Resurfaces at the European 3D TSV Summit

Alchimer Resurfaces at the European 3D TSV Summit

It had been awhile since I heard from the folks at Alchimer about the progress of electrografting (eG), its “all wet” nanometric film deposition processes.  For a while, it seemed like there were exciting things to report every few months, and then POOF – All went dark. So I was happy to find out that the company and its technology is alive, well and experiencing a re-bound after corporate ... »