As dedicated as I am to the 3D integration cause, there’s not much that will get me out of bed for a 7am presentation….unless, of course, food is involved. Honestly, images of free breakfast is what got me to show up for Rao Tummala’s presentation on Georgia Tech’s Packaging Research Center’s research activities on 3D systems.

It was a good turnout, and Rao’s overview focused on the PRC’s industry centric approach to process development. I was thinking at first that this wasn’t unique, that other research institutes such as SEMATECH also are industry centric. Then the light bulb went off on the distinction between the two; while SEMATECH is an industry research institute, Georgia Tech is first and foremost an academic institution, and as such, it takes a unique approach to engage engineering students of various persuasions (electrical, chemical, mechanical) to develop viable, cost-effective solutions for real industry challenges. Latest activities focus on 3D systems founded on the concept of silicon or glass interposers as an alternative to 3D ICs to achieve required functionality, size, performance and cost benefits.


After a busy morning of sessions and interviews, lunch was calling – and so was Nassar Grayeli’s keynote address. On behalf of Intel, he reaffirmed once again what many industry executives have been predicting, talking about the challenges and opportunities that lie ahead in this digital age.  By 2015, Grayeli says there weill be 1B more internet users, 10B more connected devices, 8x more internet traffic and 16x more storage needed. “There will be more people, doing more things with more types of devices,” he stated. From the company that’s responsible for coining the phrase, “More than Moore” this certainly brings new meaning to More. His key takeaway message; quality systems must evolve to meet new markets or risk failure. Additionally, new approaches and capabilities are a “must-have to survive”. I’m thinking, this speaks directly to the 3D Revolution, does it not?



I’m sure I’m not alone in this thinking but everyone knows that the true success of a technical conference has as much to do the session content as it does with making sure there are plenty of opportunities to eat, drink and network.  Because even those who eat, drink and breathe technology need to cut loose and have some downtime with their industry friends. Even engineers can’t live on technology alone. So after the end of the first day, a group of us headed to the boardwalk in search of entertainment to celebrate Rosalia Beica’s (Applied Materials) birthday (above). But first, we had to demonstrate high density advanced packaging by seeing how many of us we could stuff into the photo booth (below).  (Keith Cooper (SET) commented that high density usually refers to how many chips can be stuffed in a package, not engineers.)



I’m sure I’ll come up with more to say about this week as I sift through all my notes, but thought I should get something posted. But now, the gala reception is calling…. and you know what that means!  F.v.T

Francoise von Trapp

They call me the “Queen of 3D” because I have been following the course of…

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