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3D IC Test: Now and The Road Ahead

Solutions for 3D IC test are ready today, but they will be more ready tomorrow. At the 2015 ISTFA, I presented a tutorial titled “What is New in 3D, Digital Testing?” and I’ll summarize the main points here. I consider test standards and test challenges, which include known-good-die and testing stacked die. The two main goals of 3D IC test are to improve the pre-packaged test quality and to ... »

With 3D Memory Cubes You Can Finally Break Down the Dreaded Memory Wall

With 3D Memory Cubes You Can Finally Break Down the Dreaded Memory Wall

In July and August schools are closed and many people like to take vacation. Typically nothing major happens during these months. Not this year! It was a lively August, if you consider the recent “adjustments” in the stock markets worldwide as a series of events disrupting the summer doldrums. But I am not here to give you investment advice. So let’s move on to a subject I am more familiar w... »

Why You Missed Your 2014 3D Stacked DRAM Equipment Shipment Forecast

Why You Missed Your 2014 3D Stacked DRAM Equipment Shipment Forecast

Remember SEMICON West 2012? How could you forget? It was all clubbing with your customers at The Redwood Room, DNA Lounge, and The Endup after a few standout meals with them at Mission Chinese Food, Slanted Door, Wayfare Tavern, Acquerello, and Absinthe that were preceded by a few drinks with the team at House of Shields, Rickhouse, and The Old Ship Saloon that followed a day on the show floor tha... »

Are we Getting Mixed Messages on 3D IC Production?

Are we Getting Mixed Messages on 3D IC Production?

While 3D IC production is underway for memory devices, some say demand for 3D ICs is still years away. Could both be right, or are we getting mixed messages? Today’s news from  SEMICON Taiwan, in which a DigiTimes reporter quoted Mike Liang, president of Amkor Technology Taiwan as saying that 3D IC parts won’t be in demand for another three years, threw a bit of cold water on excitement gener... »