Mentor

Image Courtesy of TSMC Ltd.

TSMC’s OIP 2017 Symposium Shows The Awesome Power of an Ecosystem

Last week, September 13 to be exact, TSMC held its Open Innovation Forum (OIP 2017) Symposium at the Santa Clara Convention Center. Before getting into product and market details, allow me to share some of my general impression of this, as usual, very well-organized event. After several decades of experience with alliance management and ecosystem building, I see TSMC as the master of these discipl... »

New Design Flow and OSAT Alliance Program Jump-Start High-density Advanced Packaging

New Design Flow and OSAT Alliance Program Jump-Start High-density Advanced Packaging

Editor’s note: For several years now, Mentor Graphics has evangelized about the critical need for assembly design kits to enable commercialization of high-density advanced packaging technologies, such as fine line and space fan-out, 2.5D and 3D IC packages. With this week’s introduction of a unique, end-to-end, high-density advanced packaging (HDAP) design flow, combined with the launch of an... »

EDPS 3D Friday – The Vendor’s Turn

In addition to my Monday blog post, there has been a plethora of articles authored by other industry bloggers about the 3D Friday event, most of them focused on the user perspective, as well as the panel.  I haven’t seen a whole lot of attention paid to the vendors, Mentor, Cadence and Synopsys – all who had some input on their company’s offerings and readiness for 3D IC so far.  So I will »