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Wally Rhines Discusses the Importance of EDA and Design at IWLPC 2018

Wally Rhines Discusses the Importance of EDA and Design at IWLPC 2018

At this year’s International Wafer-level Packaging Conference, almost 1000 semiconductor experts from all parts of the supply chain gathered at the DoubleTree Hotel in San Jose from October 23 to 25. Among them were also several electronic design automation (EDA) experts who discussed how to streamline die-package-board co-design. They explained how EDA tools enable higher performance per Watt a... »

Designing and Integrating MCM/SIP Packages into Systems PCBs

Designing and Integrating MCM/SIP Packages into Systems PCBs

Traditionally, MCMs (Multi-Chip-Modules) were a way of integrating several ASICs, or ASICs and memory, into a lower-cost, smaller form-factor, robust module that was an alternative to a single large SoC. Instead of integrating all or most of the systems PCBs needs onto a large and complex single SOC, you could design and fabricate smaller, high-yielding ASICs (Figure 1) and make them behave like a... »

Announcing the Winners of the 2018 3D InCites Awards

Announcing the Winners of the 2018 3D InCites Awards

We are pleased to announce the winners of the 2018 3D InCites Awards, sponsored by KLA-Tencor and EV Group and hosted by iMAPS. This may have been the most exciting awards year yet, with 40 nominees from 26 companies and four research institutes competing for awards in 9 categories. The competition was fierce! We logged in over 40,619 online votes, more than twice the number of last years event. T... »

Image Courtesy of TSMC Ltd.

TSMC’s OIP 2017 Symposium Shows The Awesome Power of an Ecosystem

Last week, September 13 to be exact, TSMC held its Open Innovation Forum (OIP 2017) Symposium at the Santa Clara Convention Center. Before getting into product and market details, allow me to share some of my general impression of this, as usual, very well-organized event. After several decades of experience with alliance management and ecosystem building, I see TSMC as the master of these discipl... »

New Design Flow and OSAT Alliance Program Jump-Start High-density Advanced Packaging

New Design Flow and OSAT Alliance Program Jump-Start High-density Advanced Packaging

Editor’s note: For several years now, Mentor Graphics has evangelized about the critical need for assembly design kits to enable commercialization of high-density advanced packaging technologies, such as fine line and space fan-out, 2.5D and 3D IC packages. With this week’s introduction of a unique, end-to-end, high-density advanced packaging (HDAP) design flow, combined with the launch of an... »

EDPS 3D Friday – The Vendor’s Turn

In addition to my Monday blog post, there has been a plethora of articles authored by other industry bloggers about the 3D Friday event, most of them focused on the user perspective, as well as the panel.  I haven’t seen a whole lot of attention paid to the vendors, Mentor, Cadence and Synopsys – all who had some input on their company’s offerings and readiness for 3D IC so far.  So I will »