Latest Posts
Fan-out Packaging Confirms its Success Story
Fan-Out packaging solutions have been the hottest topic in the advanced packaging industry for two years, and that will remain...
MCM, SiP, SoC, and Heterogeneous Integration Defined and Explained
Multichip module (MCM), system-in-package (SiP), system-on-chip (SoC), and heterogeneous integration are all important semiconductor packaging technologies. They deserve to have, at...
A Fan-Out Wafer Level Packaging Epiphany
I’ve had an epiphany regarding fan-out wafer level packaging (FOWLP). Epiphany: “A usually sudden manifestation or perception of the essential...
Heterointegration, Friend or Foe: Opening the Door for Technologies Beyond Moore’s Law Silicon
What is heterogeneous integration, and is it my friend, or is it my foe? Why does it seem everywhere one...
Sensors Expo 2015 and The Internet Of Messy Things
What are the implications for the Internet of Things when the “Things” are human beings? As was said in a...
Riding Out on a Horse and in on a Goat: 3D IC Predictions for MEMS
The Lunar New Year is soon upon us, and we will be celebrating the Year of the Goat with firecrackers,...
Apple and IBM on the Way to Demonstrate That ONE plus ONE is More Than TWO
Tuesday’s (July 15) Nightly Business Report surprised me with an – in my view – very important announcement: Apple and...An Industry in Flux: Semiconductor Giants Strategize for the Future
All it takes is one look at the recent line-up on IHS iSuppli’s annual Semiconductor company ranking-by-revenue to see change is...Nostalgia Trip
Is today the anniversary of something and I missed the memo? Because in less than 5 minutes of surfing, I’ve...
Just another 3D Monday
For me, Mondays are about regrouping, getting out of weekend head and into what’s going on in the 3D world....Tribute to Steve Jobs: 1955-2011
Today is a sad day in the high tech industry. The news of the death of Apple Founder, Steve...