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The Benefits of Photonic Debonding in Advanced Semiconductor and Electronics Manufacturing

The semiconductor industry is rapidly advancing, with an increasing emphasis on cutting-edge packaging techniques such as heterogeneous integration (HI), 3D heterogeneous integration (3DHI), and chiplets. These innovations necessitate efficient, cost-effective, and damage-free debonding processes to ensure high-yield manufacturing. Conventional mechanical and laser-based debonding methods often introduce challenges such as thermal...

Productronica China

Indium Corporation to Showcase Innovative Materials Powering AI Technology at Productronica China

As a proven leader in metal-based thermal interface materials solutions for future-forward technologies, Indium Corporation will proudly showcase its portfolio of thermal interface materials (TIMs) that are enabling AI advancements at Productronica China, March 26-28, in Shanghai, China. Indium Corporation’s GalliTHERM® portfolio of gallium-based liquid metal solutions builds on more...

The Growing Importance of Advanced Packaging in Europe – Recap of ERS TechTalk

Advanced packaging has emerged as a critical enabler of next-generation applications for artificial intelligence (AI), high-performance computing, wearables, 6G communication, and defense technologies. As traditional scaling approaches face increasing limitations, Advanced packaging enables further miniaturization and improved performance through heterogeneous integration, chip stacking, and high-density interconnects. In Europe, advanced packaging...

Member Preview

SEMICON China 2025 Member Preview

Are you heading to SEMICON China this year? Taking place from March 26-28 at SNIEC in Shanghai, SEMICON China will feature programs on IC manufacturing, supply chain management, compound semiconductors, sustainability, workforce development, and more. Six of our 3D InCites member companies will be presenting, and 12 will be exhibiting. If...

LCE

SEMI Energy Collaborative Releases Recommendations for Building Low-Carbon Energy Supply in Singapore

The SEMI Energy Collaborative today publicly released its analysis and report: Challenges and Potential Solutions for Acceleration of Low-Carbon Energy Deployment in Singapore. Now available for download, the report combines input from SEMI and its Energy Collaborative sponsors and suggests solutions for policymakers, low-carbon energy (LCE) developers, and semiconductor industry companies to further increase...

SEMI ISS 2025: Ready, Set, Ramp!

The semiconductor industry has been discussing breaching the 1 trillion-dollar mark as it was coming out of COVID-19 and amid a boom year in 2022. The slowdown in 2023 had some resetting the dates for when the industry would crest the 1 trillion mark. The AI boom of 2024 has...

The 3D InCites Podcast Backtrack – 2024 in Review

Buzzsprout, the platform where the 3D InCites podcast lives, does a cool thing at the end of the year. It provides the podcast backtrack –  a recap of your stats, including the top performing episodes. So we thought we’d share it with you, our listeners and sponsors, to give you...

SEMI Publishes Recommendations for Semiconductor Policies in the 2024-2029 European Commission Legislative Term

SEMI, the industry association serving the global electronics design and manufacturing supply chain, today published recommendations for the European Union to bolster its semiconductor ecosystem. The SEMI Europe Recommendations for the 2024-2029 Legislative Term paper urges the new Commissioners assuming office to implement legislation to advance the semiconductor sector given its role...

2025 3D InCites Best Place to Work Awards Finalists

2025 3D InCites Best Place to Work Awards Finalists Vote for Best Place to Work 2025 EV Group At EV Group (EVG), employees, or “EVG insiders,” are at the forefront of turning innovative visions into real-world technology, shaping the future of industries like smartphones, medical technology, and virtual reality. The...