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November was a dynamic month for the 3D InCites community and the broader semiconductor industry, with companies showcasing innovative technologies, celebrating leadership achievements, expanding global operations, and advancing workforce development. From product launches and AI‑enhanced design platforms to award recognitions and strategic partnerships, industry leaders highlighted breakthroughs in advanced packaging, inspection,...
Greek Semiconductor Specialist Joins Space South Central to Advance 3D Compound–silicon Integration for Satellite and Defence Communications Greek semiconductor design company Circuits Integrated Hellas has joined Space South Central, one of the UK’s largest regional space clusters, to strengthen its ties with the UK’s growing semiconductor and space manufacturing sectors. The...
Programs to Focus on Sustainable Solutions to Meet Evolving Industry Requirements Semiconductor industry experts will convene at SEMICON Europa 2025, November 18-21 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management. The Advanced Packaging Conference (APC), Fab Management Forum (FMF) and MEMS and Imaging Sensors Summit (MEMS)...
The month of September saw continued momentum in the semiconductor industry, highlighted by exciting industry events, innovative technology launches, and international collaborations. Companies unveiled new process solutions, inspection systems, and AI-enabled design tools, emphasizing advancements in materials, memory, and compound semiconductor manufacturing. Workforce development initiatives strengthened ties between academia and...
MacDermid Alpha presents advanced packaging and power semiconductor materials at SEMICON Taiwan, highlighting reliability, sustainability, and expert insights at the TechXPOT forum. MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, will showcase its advanced packaging solutions for next-generation semiconductor devices at the...
Discover the key challenges in semiconductor capital equipment logistics—and how to build a proactive, flexible, and future-ready supply chain that prioritises safety, security, and minimal handling Interview with Barry O’Dowd, Senior Vice President, Global Head of Business Development for Semiconductors Q: What are the main logistics challenges when moving fab...
The month of August held pivotal shifts in the semiconductor industry, marked by leadership transitions, targeted investments, and continued innovation across packaging, inspection, and AI-enabled design tools. Companies introduced advanced process solutions and new product lines at global events, underscoring the sector’s push toward higher reliability, efficiency, and scalability in...
Event registration now open, with expanded programming and support from key Arizona partners SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced strategic partnerships for this year’s SEMICON® West with Alliance Sponsors Arizona Commerce Authority (ACA), Greater Phoenix Economic Council (GPEC), and Visit Phoenix. These collaborations...
I was recently invited by IMAPS UK to give a keynote at their annual conference, MicroTech 2021. The topic was Heterogeneous Integration (HI). I agreed, provided I was allowed to give the topic a new twist. I provided the following abstract, and the committee eagerly agreed to my proposal: A...
Adjusting or repairing some of the sprinkler heads on my lot is a regular Spring duty for me. This year, when I was working on my front lawn, my 97-year old neighbor, a former doctor (MD), and the only original owner of one of the 70-year old homes on our...
