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Guest bloggers from across the supply chain and from various market segments contribute to provide insight on the implications of 3D integration technologies. Industry experts who have something to say are invited to participate.

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Indium Corporation’s Andy Mackie Talks About Materials Science

“We believe that materials science changes the world,” declared Indium Corporation’s Andy Mackie during our recent sit-down together at IMAPS 2019 in Boston, MA. Even though I am a chemical engineer myself, and not a materials scientist, Andy Mackie, Ph.D., senior product manager, is reaching the choir, one engineer to another, right from the start, talking about Indium Corporation’s mater... »

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IMAPS 2019: Stalled Scaling Begets AI Opportunities For Heterogeneous Integration

Chiplets and 5G were a kind of buy-in to play at the IMAPS 2019 Symposium high-stakes table last week in Boston, MA, but it was heterogeneous integration that took many a pot during the three days of the symposium, particularly when IBM Research held the HI cards. The quick summary from IMAPS about attendance at the Symposium is that “Final registration figures proved that IMAPS 2019 was the in... »

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Moore’s Law Rises from the Dead Again Thanks to 3D Transistor Technology

In July at SEMICON West, there was a great deal of discussion that Moore’s Law was dead and would likely not be revived. Fast forward to September at SEMICON Taiwan, and the CEO of TSMC, Mark Lui announced that TSMC believes that Moore’s law is very much alive. Dr. Lui stated that Moore’s Law will continue for another few generations thanks to developments in advanced process technology ... »

Q2 2019: Memory Business is Approaching the Bottom

“Combined DRAM and NAND revenue was US$25.4 billion in Q2 2019, down 5% from Q1 and down 39% year-over-year as sluggish demand and elevated inventory levels continued to plague the memory markets”, announces Simone Bertolazzi, Memory Technology & Market Analyst at Yole Développement (Yole). What is the latest news on the memory business? What is the status of the market indicators? Is the... »

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EPS 2019: Imagining Thomas Edison as the Father of Advanced Packaging

Thomas Alva Edison didn’t invent semiconductor device packaging, but he might have, had he lived just one more generation. “I find out what the world needs. Then I go ahead and try to invent it.”* Edison passed away in 1931, less than twenty years before John Bardeen, Walter Brattain, and William Shockley invented the transistor at Bell Labs in 1947, starting our electronic age. Bring to you... »

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How 3D Keeps the Semiconductor Industry Scaling

Imec did their usual stellar job of demonstrating what needs to happen in the semiconductor manufacturing world to enable the next generation of semiconductor devices and keep the industry moving forward to achieve 3nm integrated circuits (ICs). More importantly, however, they discussed how to use 3D in both packaging and transistor cell design to achieve system integration that will enable integr... »

Courtesy of Yole Développement, 2019 Courtesy of Yole Développement, 2019

TOP 25 OSATs Ranking: Survival of the Fittest?

Out of the top 25 OSATs, Taiwan-based OSATs contributed more than half of the revenue in 2018 followed by China, US, and Malaysia. The leading giant of the outsourced semiconductor and test service providers (OSATs), ASE Technology Holding Co., Ltd. (formerly ASE Inc.) and subsidiaries, has got even bigger after the official acquisition of SPIL on April 30, 2018. In 2018, ASE Technology Holding Co... »

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SEMI ASMC 2019: Heterogeneous Integration Enters the Mix

“It’s relatively easy to build a fancy new transistor in the lab, but in order to replace what we’re doing today, you need to be able to put billions on a chip, at a reasonable cost, with high reliability and almost no defects. It is very difficult. That makes it all the more important to pursue other ways of making better computers.” Linley Gwennap, in The Economist, March 2016. “It may... »

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The ECTC Time Machine: Lead-free Solder, Environmental Reporting, and Next-Generation Sensors

Attending ECTC 2019 this year was like a trip through a time machine. From my post at the 3DInCites booth, I talked to people I’ve known for decades and others I was meeting for the first time. By visiting booths and listening to presentations, I gained insight into how the semiconductor packaging industry has evolved in the past decade and why work I did ten or 25 years ago is newly relevant. E... »

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Heterogeneous Integration Component Flavors SEMI ASMC 2019

“It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and interconnected. The availability of large functions, combined with functional design and construction, should allow the manufacturer of large systems to design and construct a considerable variety of equipment both rapidly and economically.” G. Moore, “Cramming more comp... »

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