From Different Dimensions

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Guest bloggers from across the supply chain and from various market segments contribute to provide insight on the implications of 3D integration technologies. Industry experts who have something to say are invited to participate.

Q2 2019: Memory Business is Approaching the Bottom

“Combined DRAM and NAND revenue was US$25.4 billion in Q2 2019, down 5% from Q1 and down 39% year-over-year as sluggish demand and elevated inventory levels continued to plague the memory markets”, announces Simone Bertolazzi, Memory Technology & Market Analyst at Yole Développement (Yole). What is the latest news on...

How 3D Keeps the Semiconductor Industry Scaling

Imec did their usual stellar job of demonstrating what needs to happen in the semiconductor manufacturing world to enable the next generation of semiconductor devices and keep the industry moving forward to achieve 3nm integrated circuits (ICs). More importantly, however, they discussed how to use 3D in both packaging and...

TOP 25 OSATs Ranking: Survival of the Fittest?

Out of the top 25 OSATs, Taiwan-based OSATs contributed more than half of the revenue in 2018 followed by China, US, and Malaysia. The leading giant of the outsourced semiconductor and test service providers (OSATs), ASE Technology Holding Co., Ltd. (formerly ASE Inc.) and subsidiaries, has got even bigger after...