Francoise von Trapp (aka the Queen of 3D) has been following and reporting on the progress of 3D integration technologies since 2009. Francoise in 3D provides a high-level perspective of 3D industry events, offers executive viewpoints, and focuses on process and manufacturing aspects of 3D integration.
And in My Spare Time…..
Things have been pretty crazy lately, what with wearing several hats and all. I spent two days in Silicon Valley last week visiting some companies on behalf of Chip Scale Review, and also at SEMI for an Advanced Packaging Committee meeting for SEMICON West to hammer out the 3D program. ...
Will Write for Food (Or Random Thoughts from ECTC 2011)
As dedicated as I am to the 3D integration cause, there’s not much that will get me out of bed for a 7am presentation….unless, of course, food is involved. Honestly, images of free breakfast is what got me to show up for Rao Tummala’s presentation on Georgia Tech’s Packaging...
2011: Closing in on 3D Commercialization
It looks like it’s all starting to come together. 2010 closed out with promising news for 3D ICs and TSV technology. At SEMI’s Industry Strategy Symposium (ISS) this week in Half Moon Bay, CA, this news was reiterated by industry executives. (Unfortunately, I didn’t attend, but I’ve been reading about...
Elephants, Bunnies, and Sandwiches: A Few Favorite Things from the GSA Memory Conference
Symbolism and analogies were flying fast and furious yesterday at the GSA Memory Conference in San Jose, CA. which addressed 3D Architecture with Logic & Memory Integrated Solutions. I always appreciate when technologists show their senses of humor. It makes an otherwise dry topic lots more interesting to write about....
Will 3D Integration Keep 2nd Tier Foundries Alive?
Last week, I was reading a press release on iSuppli's website titled, And Then There Were Three: Ranks of Leading-Edge Chip Foundries Dwindle and I got to thinking, if only 3 major foundries (TSMC, GlobalFoundries, and Samsung) are going to be able to handle the cost of high volume, leading-edge ...
Our Baby’s All Grown Up!
I just read Mark LePedus’ (EE Times) coverage of the 3-D Architectures for Semiconductor Integration and Packaging last week in Burlingame, and I was wondering if we’d both been at the same event, or was he just not paying attention? TSV not ready to for prime time? I beg to...
New era calls for new strategies
I’ve always been good at connecting the dots. I find it easier to understand a novel concept if I can apply it to something I already know about.
Calling All 3D and Advanced Packaging Groupies: Your Input is Requested!
Here’s the great thing about establishing a community like 3D InCites: you’ve suddenly got the people who care the most about the topic literally at your fingertips. That’s one of the reasons SEMI came to me for advice on setting up the 3D IC and advanced packaging programs at SEMICON...
My Sojourn to SEMATECH
I’m a big believer in building relationships. One of my goals with 3D InCites is to make the rounds of all the research organizations with 3D IC programs, not only to ogle all the cool tools and compare 300mm clean rooms, but to get a real feel for how each...
What’s in Store for 3D Fans at IWLPC 2010
I was so busy making sure I have all the bios and presentations for the 3D sessions I’m chairing at this year’s IWLPC, which got underway today with its half-day tutorials, that I was LATE checking in on Southwest and ended up in the B group for boarding. I hate...
