09/24/2013 -All Day

Location: Biltmore Hotel and Suites

Loading Map....

During its long and successful existence, MEPTEC has recognized the need for one essential ingredient above all others in achieving success with any semiconductor industry roadmaps: collaboration. This event will consist entirely of panel discussions, rather than traditional presentations to encourage interaction among the speakers and attendees, so that the synergies, gaps, and differences of opinion can be explored more thoroughly.

This year’s program is divided into four panel sessions on the following topics:

  • Device Market Drivers, Session Chair: Joel Camarda, Amonix
    Requirements in device functionality, power, and mobility continue to drive the packaging roadmap. A panel of product experts, including representatives from semiconductor and mobile consumer product companies, will discuss their packaging roadmaps and the challenges therein.
  • Connecting Semiconductor Roadmaps, Session Chair, Jeff Demmin, STATS ChipPAC
    It is more important than ever that companies consider their supply chain partners — both upstream and downstream — when creating their roadmaps for their own businesses. This panel discussion will allow representatives of OEMs, OSATS, and IC manufacturers to discuss how they interact with suppliers, customers, and their customers’ customers to help their businesses move forward with coordinated roadmaps.
  • New Reliability Requirements, Session Co-Chairs: Ivor Barber, Xilinx and John Xie, Altera
    The modern packaging engineer needs to satisfy a plethora of non-mechanical requirements associated with high speed and high bandwidth signaling, power integrity and multi die packaging. The panelists of this session will discuss the impact of emerging interconnect standards on package performance requirements and discuss the level of collaboration between users and providers within their discipline. 
  • The Importance of Industry Organization Collaboration Session Leader: Phil Marcoux, PPM Associates
    Recent technologies such as 3D are getting R&D help from the increasingly coordinated efforts of international consortia, and infrastructure to boost the successful technologies is coming from the major standards groups. This session will consist of a panel of representatives from these organizations who will provide an update on their progress and discuss how they can work together to further assist the industry in developing and adopting advanced technologies.

For further details, visit the MEPTEC 2013 Semiconductor Roadmap Symposium webpage