Early Registration for the 15th Annual IWLPC Conference Ends September 28, 2018
Join industry leaders, technologists, and innovators at the 15th Annual International Wafer-Level Packaging Conference & Exhibition (IWLPC). Held in San Jose, CA, the IWLPC continues to be the premier semiconductor packaging conference and exhibition focused on wafer-level packaging. This year’s conference theme, “Driving an Interconnected World,” emphasizes the growing importance of advanced wafer-level interconnect technologies to enable advanced system-level packaging solutions for applications such as automotive, communications, and high-performance computing. The IWLPC provides a dynamic environment for learning, networking, and technical exchange. This year’s conference comprises three major parts: the technical program, the workshops, and the technology exhibition. The technical program has three parallel tracks with two full days of presentations on wafer-level packaging, 3D integration, and advanced manufacturing technologies.
Keynote Presenters include:
- Growth of WLSI and Wafer Foundry with Moore’s Law and More-than-Moore, and Vice Versa
Douglas C.H. Yu, Ph.D.
Vice President, Research & Development
Taiwan Semiconductor Manufacturing Company (TSMC)
- Monolithic versus Heterogeneous Packaging: Where Does the Future Lie?
Walden Rhines, Ph.D.
President and Chief Executive Officer
Mentor, a Siemens business
- Interconnected World and the Automotive Paradigm
Veer Dhandapani, Ph.D.
Head of Automotive Packaging
What is the Sweet Spot for Large Area (Panel) Packaging?
Tanja Braun, Fraunhofer IZM
E. Jan Vardaman, TechSearch International, Inc.