Early Registration for the 15th Annual IWLPC Conference Ends September 28, 2018
Join industry leaders, technologists, and innovators at the 15th Annual International Wafer-Level Packaging Conference & Exhibition (IWLPC). Held in San Jose, CA, the IWLPC continues to be the premier semiconductor packaging conference and exhibition focused on wafer-level packaging. This year’s conference theme, “Driving an Interconnected World,” emphasizes the growing importance of advanced wafer-level interconnect technologies to enable advanced system-level packaging solutions for applications such as automotive, communications, and high-performance computing. The IWLPC provides a dynamic environment for learning, networking, and technical exchange. This year’s conference comprises three major parts: the technical program, the workshops, and the technology exhibition. The technical program has three parallel tracks with two full days of presentations on wafer-level packaging, 3D integration, and advanced manufacturing technologies.
Keynote Presenters include:
- Growth of WLSI and Wafer Foundry with Moore’s Law and More-than-Moore, and Vice Versa
Douglas C.H. Yu, Ph.D.
Vice President, Research & Development
Taiwan Semiconductor Manufacturing Company (TSMC) - Monolithic versus Heterogeneous Packaging: Where Does the Future Lie?
Walden Rhines, Ph.D.
President and Chief Executive Officer
Mentor, a Siemens business - Interconnected World and the Automotive Paradigm
Veer Dhandapani, Ph.D.
Head of Automotive Packaging
NXP Semiconductors
Panel Discussion:
What is the Sweet Spot for Large Area (Panel) Packaging?
Moderators:
Tanja Braun, Fraunhofer IZM
E. Jan Vardaman, TechSearch International, Inc.
