IEEE International Electron Devices Meeting (IEDM) is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.The 2014 IEEE International Electron Devices Meeting, which takes place December 15-18, 2014 will feature a number of 3D integration-related events, beginning with a pre-meeting short course “3D System Integration Technology“ led by Eric Beyne, imec, on Sunday, December 15.
- Session 4, Monday, December 15, reports on display and imaging systems; specifically advanced image sensors and light emitting devices (LEDs).
- Session 14, Tuesday, December 16, looks at characterization, reliability and yield for advanced memories and TSVs
- Session 27, Wednesday, December 17, focuses on process and manufacturing technology for hybrid and 3D integration
For the full program and to register, visit the IEDM 2014 website.