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From 3D technologies to Heterogeneous Integration and High-Density Systems for different applications
The 3D and Systems Summit will address the most relevant and controversial topics related to 3D integration and system in packaging manufacturing as well as applications. A brand new agenda, invited high-caliber speakers, exhibition area and unique networking opportunities to all participants and exhibitors. Register now! 28-30 January 2019, Dresden, Germany.
2019 MAIN TOPICS & HIGHLIGHTS
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