01/28/2019 - 01/30/2019 -All Day

Location: Dresden Hilton Hotel

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From 3D technologies to Heterogeneous Integration and High-Density Systems for different applications

The 3D and Systems Summit will address the most relevant and controversial topics related to 3D integration and system in packaging manufacturing as well as applications. A brand new agenda, invited high-caliber speakers, exhibition area and unique networking opportunities to all participants and exhibitors. Register now!  28-30 January 2019, Dresden, Germany.

  • 3DIC Through-Silicon-Via (TSV) technology
  • 2.5D, 3D FO-WLP/e-WLB
  • Active and passive interposers
  • Stacked dies or stacked wafers
  • 3D alternative technologies
  • 5G Integration
  • Invited speakers and Keynotes
  • Exhibition area
  • Networking opportunities