The Design Automation Conference (DAC 2014) is recognized as the premier event for the design of electronic circuits and systems, electronic design automation (EDA) and embedded systems and software (ESS).
Members are from a diverse worldwide community of more than 1,000 organizations that attend each year, represented by system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives, and researchers and academicians from leading universities.
Close to 300 technical presentations and sessions are selected by a committee of electronic design experts offer information on recent developments and trends, management practices and new products, methodologies and technologies.
The conference is sponsored by the Association for Computing Machinery (ACM), the Electronic Design Automation Consortium (EDA Consortium), and the Institute of Electrical and Electronics Engineers (IEEE), and is supported by ACM’s Special Interest Group on Design.
Of interest to 3D Integration Enthusiasts:
KEYNOTE: Industry Opportunities in the Sub-10nm Era
Dr. Cliff Hou, Vice President, Research and Development – TSMC
…In less than two years we’ll be in production at 10nm, and shortly after 7nm, all made possible by a “Grand Alliance” of design ecosystem, equipment and material suppliers. At the same time, a new paradigm is being realized: heterogeneous silicon integration combining chips from multiple process technologies with 3D packaging to deliver compelling economics for a “System in a Si Superchip.”…The introduction of 10nm and 7nm processes will alter today’s ecosystem while opening greater EDA and IP opportunities, and present new system and chip design challenges such as near threshold design, thermal and battery limitations, and 3D IC considerations…