DATE 2014 3D Integration Workshop

DATE 2014 3D Integration Workshop

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Date/Time
Date(s) - 03/28/2014
All Day

Location
Maritim Hotel & Internationales Congress Center Dresden

Category(ies)


The Design, Automation, and Test in Europe conference and exhibition is the main European event bringing together researchers, vendors and specialists in hardware and software design, test and manufacturing of electronic circuits and systems. Friday Workshops are dedicated to emerging research and application topics. You won’t want to mis this year’s  DATE 2014 3D Integration Workshop.

The  is 3D Integration – Applications, Technology,  Architecture, Design, Automation, and Test. 3D Integration is a promising technology for extending Moore’s momentum in the next decennium, offering heterogeneous technology integration, higher transistor density, faster interconnects, and potentially lower cost and time-to-market. To produce 3D chips, new capabilities are needed: process technology, architectures, design methods and tools, and manufacturing test solutions. The goal of this Workshop is to bring together researchers, practitioners, and others interested in this exciting and rapidly evolving field, in order to update each other on the latest state-of-the-art, exchange ideas, and discuss future challenges.

The workshop opens with a an invited keynote: 3D Technology Applications Market Trends & Key Challenges presented by Thibault Buisson, Technology & Market Analyst, Advanced Packaging,Yole Développement. A special session on Reliability and Thermal issues in 3D ICs will feature and Overview of 3D-Reliability Research at Imec, presented by imec’s Kristof Croes. Frank Altmann, Fraunhofer IWN Halle, will present Advanced Failure Analysis Techniques for 3D Packages; and Haykel Ben Jaama, CEA_LETI, will discuss Research Directions on Thermal Impact of 3D Assembly. 

In addition to two technical sessions with 10 regular presentations, highlights of the day include an invited talk by Maaike Visser – SINTEF, Norway who will present Heterogeneous Sensor Integration; Increased Technology Readiness Level; as well as an provocative panel discussion examining: Are Slow Standardization and CAD-Tool Development Hindering the Progress of 3D IC Design and Integration? moderated by  Françoise von Trapp – “Queen of 3D”, 3DInCites. Panelists include:

  • Brandon Wang – Cadence Design Systems, US
  • Ron Press – Mentor Graphics, US
  • Makoto Nagata – Kobe University, JP
  • Mustafa Badaroglu – Qualcomm Technologies, BE

A detailed version of the 3D Workshop program is now available.